Put Honeywell PTM7950 on CPU and thermal putty on top of the heatsink so it will transfer the heat to the laptop case itself. Using thermal putty on CPU is stupid and just a no-go.
Care to elaborate? There was some kind of putty out of the box, as you probably noticed. Definetely not a "no-go" for Apple. Don't see any problem puttin a putty if it does the job.
Additionally, there is a significant gap between the chip and the heatsink. Around 0.3 mm if I had to guess. So, I'd say, that the honeyway stuff is a "no-go" in this particular case.
@@angryleePutties are generally suited for VRMs and VRAM. If you're getting a gap by using Honeywell, increasing the pressure can make the difference if you're not getting contact. Had some issues where my RX6800m wasn't getting contact, but my 5900HX was. 20°C's one heck of a drop though 👀
The fact that putties are designed for VRMs doesn't answer the question of why I can't use them on the CPU in this particular case, where it draws around 8W or so. Also, refer to 1:15 in the video. The heatsink is mounted on screw stands, and there is a gap by design. It is impossible to eliminate that gap by applying more pressure. The gap exists and needs to be filled with something thick, like putty. The black putty is there by design. It was put there by Apple, not me. No amount of pressure will make the CPU and heatsink contact properly in this particular case. Therefore, I still don’t understand why I should take extra steps (and spend extra-money) to achieve no extra performance. Applying ceramic pad proved that thermal putty is more than sufficient in this case, and using other thermal interfaces doesn’t make sense, since it won't get me better thermals - or, I might say, it is impossible - due to the significant gap between the heatsink and the chip, which is there by design and impossible to eliminate.
Can i use this in my cellphone?
cool!
dont buy macbook air there is no fans in 2024.... wtf
Put Honeywell PTM7950 on CPU and thermal putty on top of the heatsink so it will transfer the heat to the laptop case itself. Using thermal putty on CPU is stupid and just a no-go.
Care to elaborate?
There was some kind of putty out of the box, as you probably noticed. Definetely not a "no-go" for Apple. Don't see any problem puttin a putty if it does the job.
Additionally, there is a significant gap between the chip and the heatsink. Around 0.3 mm if I had to guess. So, I'd say, that the honeyway stuff is a "no-go" in this particular case.
@@angryleePutties are generally suited for VRMs and VRAM. If you're getting a gap by using Honeywell, increasing the pressure can make the difference if you're not getting contact. Had some issues where my RX6800m wasn't getting contact, but my 5900HX was.
20°C's one heck of a drop though 👀
The fact that putties are designed for VRMs doesn't answer the question of why I can't use them on the CPU in this particular case, where it draws around 8W or so. Also, refer to 1:15 in the video. The heatsink is mounted on screw stands, and there is a gap by design. It is impossible to eliminate that gap by applying more pressure. The gap exists and needs to be filled with something thick, like putty. The black putty is there by design. It was put there by Apple, not me. No amount of pressure will make the CPU and heatsink contact properly in this particular case.
Therefore, I still don’t understand why I should take extra steps (and spend extra-money) to achieve no extra performance. Applying ceramic pad proved that thermal putty is more than sufficient in this case, and using other thermal interfaces doesn’t make sense, since it won't get me better thermals - or, I might say, it is impossible - due to the significant gap between the heatsink and the chip, which is there by design and impossible to eliminate.
He is right. PTM7950 for cpu/gpu applications. Putty everywhere else. Seriously, from someone who has eaten his teath on this topic.