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iNEMI TV
Приєднався 9 лют 2018
iNEMI Packaging Tech Topic Series: Equipment Capabilities & Challenges to Support Advanced Packaging
August 20, 2024
Peter van Emmerik of Kulicke & Soffa Industries
This webinar focused on a fluxless thermo-compression bonding (TCB) process for chip-to-substrate and chip-to-wafer bonding that can eliminate the flux contamination/residue issues that limit the pitch of thermo-compression flip chip bonding - a serious problem for ultra-fine pitch interconnects. Fluxless TCB bonding is an extension of standard semiconductor assembly practices, does not require massive process and infrastructure changes as hybrid bonding does, and is in high-volume manufacturing.
Download the presentation: thor.inemi.org/webdownload//2024/Tech_Topic/Packaging/Aug_Eqpt_Capabilities-K&S.pdf
Peter van Emmerik of Kulicke & Soffa Industries
This webinar focused on a fluxless thermo-compression bonding (TCB) process for chip-to-substrate and chip-to-wafer bonding that can eliminate the flux contamination/residue issues that limit the pitch of thermo-compression flip chip bonding - a serious problem for ultra-fine pitch interconnects. Fluxless TCB bonding is an extension of standard semiconductor assembly practices, does not require massive process and infrastructure changes as hybrid bonding does, and is in high-volume manufacturing.
Download the presentation: thor.inemi.org/webdownload//2024/Tech_Topic/Packaging/Aug_Eqpt_Capabilities-K&S.pdf
Переглядів: 415
Відео
iNEMI Sustainable Electronics Tech Topic Series Webinar: CEPN’s Toward Zero Exposure Program
Переглядів 512 місяці тому
Guest speaker: Pamela Brody-Heine Senior Director, Clean Electronics Production Network (CEPN) June 27, 2024 This webinar focuses on CEPN's Toward Zero Exposure Program, a commitment program uniting companies throughout the electronics industry in a journey to protect workers from exposure to hazardous chemicals. There are five key commitment areas: 1) Eliminate exposures to priority chemicals ...
iNEMI Packaging Tech Topic Series: "Role of EDA in Advanced Semiconductor Packaging"
Переглядів 1644 місяці тому
Guest Speaker: Sang-Hyun Lee, Cadence Design Systems May 20/21, 2024 The electronics industry is no longer able to rely on the economics of semiconductor logic scaling. Technology breakthroughs in semiconductor packaging are key to transforming chips into heterogeneous integration systems. Advanced multi-chiplet 3D packages have become a very attractive option for cost-sensitive complex designs...
iNEMI Comparison of Expanded Beam & Physical Contact Connectors in Data Center Applications Project
Переглядів 734 місяці тому
Call-for-Participation Webinar: Comparison of Expanded Beam and Physical Contact Connectors in Data Center Applications Project, Phase 2 (May 14 & 15, 2024) Phase 2 of iNEMI’s Comparison of Expanded Beam and Physical Contact Connectors in Data Center Applications Project is being organized to investigate and compare the impact of contamination on the optical performance of expanded beam, physic...
iNEMI End-of-Project Webinar: Unified Equipment Interaction Methodology (April 16 & 17, 2024)
Переглядів 325 місяців тому
iNEMI’s recently completed Unified Equipment Interaction Methodology Project was a collaboration between electronics manufacturers and equipment suppliers to validate the feasibility and ease of implementation of draft SEMI standard 6926: Specification for Equipment Operator Access Management and Monitoring. This end-of-project webinar reviewed the team’s feedback on the draft standards and det...
iNEMI LTS Tech Topic Series: Thermal Fatigue Performance in BiSn-Based LTS Joints
Переглядів 506 місяців тому
Richard Coyle, PhD, Nokia Bell Labs February 20 & 27, 2024 Since 2015, iNEMI’s BiSn-Based Low-Temperature Soldering Process and Reliability Project has been evaluating low-temperature solder (LTS) paste formulations based on the Bi-Sn system. In this webinar Richard Coyle, PhD, Nokia Bell Labs, reported results and lessons learned from the project’s thermal cycling tests of low-temperature sold...
iNEMI Connector Reliability Test Recommendations End-of-Project Webinar (February 26 & 27, 2024)
Переглядів 366 місяців тому
Project Chair: Jeff Toran, Amphenol Project Co-Chair: Bob Druckenmiller, Amphenol (retired) iNEMI’s Connector Reliability Test Recommendations Project was organized to address the inability of existing connector reliability testing standards to (1) address the full range of connector applications or (2) to provide the necessary detailed, defined test conditions and sequences. A standardized rel...
End-of-Project Webinar: iNEMI mmWave Permittivity Reference Material Development Project
Переглядів 1257 місяців тому
January 17, 2024 This webinar reports on iNEMI’s recently completed mmWave Permittivity Reference Material Development Project. This project was conceived when the iNEMI 5G/mmWave Materials Assessment and Characterization Project and the NIST-sponsored 5G/6G mmWave Materials and Electrical Test Technology Roadmap (MAESTRO) both pointed to a lack of traceable permittivity standards for character...
Board Assembly Tech Topic Series: Mechanical Shock Drop Reliability of BiSn LTS
Переглядів 578 місяців тому
Raiyo Aspandiar and Jagadeesh Radhakrishnan (Intel) September 21 & October 12, 2021 This webinar shared details from the iNEMI BiSn-Based Low-Temperature Soldering Process and Reliability project team’s report on their assessment of mechanical shock reliability of BiSn in BGA solder joints. The team evaluated the effectiveness of several new solder alloy formulations in three separate mechanica...
Counterfeit Components Tech Topic Series: Emerging Trends in Counterfeit Detection and Mitigation
Переглядів 2419 місяців тому
December 7, 2023 0:00 This session looks at trends in counterfeit detection and mitigation and reviews results of an iNEMI survey regarding industry experiences with counterfeit components and strategies used to mitigate risk. 2:19 UNDERSTANDING COUNTERFEIT ELECTRONICS DETECTION AND MITIGATION Navid Asadi, Ph.D. (University of Florida) Associate Professor, Electrical and Computer Engineering De...
iNEMI Tech Topic Series: Counterfeit Components, Session 2 - Counterfeit Management & Best Practices
Переглядів 17410 місяців тому
November 7, 2023 00:01:00 INTRO 00:04:13 COUNTERFEIT AVOIDANCE AND DETECTION: AN OVERVIEW OF SAE STANDARDS Michael Azarian, PhD (CALCE, University of Maryland) Michael provides an overview of the state of SAE standards that are applicable to counterfeit avoidance and detection. The suite of standards applies to different parts of the supply chain - from OEMS to distributors to test laboratories...
iNEMI/ZESTRON Workshop on Reliability & Standards for Automotive Electronics (English)
Переглядів 3510 місяців тому
October 13, 2023 / Shenzhen, China Video overview of meeting (English)
iNEMI/ZESTRON Workshop on Reliability & Standards for Automotive Electronics (Chinese)
Переглядів 1910 місяців тому
October 13, 2023 / Shenzhen, China Video overview of meeting (Chinese)
iNEMI LTS Tech Topic Series - Electromigration in Tin-Bismuth Planar Solder Joints
Переглядів 22310 місяців тому
Presented by Prabjit (PJ) Singh (IBM) October 17 & 18, 2023 This webinar reviewed results from the first phase of iNEMI’s Electromigration in SnBi Solder for 2nd-Level Interconnects project. The project team studied electromigration in SnBi solder joints using a novel planar solder joint that allows non-destructive monitoring of the solder metallurgy while tracking the electrical behavior of th...
iNEMI Tech Topic Series: Counterfeit Components / Session 1 - Size & Breadth of Counterfeit Risks
Переглядів 16210 місяців тому
October 14, 2023 00:00:02 The initial session of iNEMI’s Counterfeit Components Tech Topics Series focused on the size and breadth of counterfeiting risks and set the stage for future discussions in this webinar series. The three presenters each provided unique insights into the topic of counterfeit components. 00:03:33 COUNTERFEIT RISK RUNS THROUGHOUT THE END-TO-END SUPPLY CHAIN Ben German (In...
Call-for-Participation: iNEMI AI Enhancement to AOI for PCBA Project, Phase 2 (July 11 & 14, 2023)
Переглядів 81Рік тому
Call-for-Participation: iNEMI AI Enhancement to AOI for PCBA Project, Phase 2 (July 11 & 14, 2023)
iNEMI Smart Manufacturing Tech Topic Series webinar featuring Roshan Naru of Aitomatic
Переглядів 42Рік тому
iNEMI Smart Manufacturing Tech Topic Series webinar featuring Roshan Naru of Aitomatic
Makersite Tells iNEMI’s Sustainable TIG How They are Helping Enterprises Achieve NetZero
Переглядів 151Рік тому
Makersite Tells iNEMI’s Sustainable TIG How They are Helping Enterprises Achieve NetZero
iNEMI Smart Manufacturing Tech Topic Series: Using AI to Automate Electronics Inspection
Переглядів 133Рік тому
iNEMI Smart Manufacturing Tech Topic Series: Using AI to Automate Electronics Inspection
iNEMI's PCB Connector Footprint Tolerance Project Call-for-Participation Webinar (May 9 & 10, 2023)
Переглядів 32Рік тому
iNEMI's PCB Connector Footprint Tolerance Project Call-for-Participation Webinar (May 9 & 10, 2023)
Board-Level Optical Interconnect Performance in Immersion-Cooled Environments Project
Переглядів 146Рік тому
Board-Level Optical Interconnect Performance in Immersion-Cooled Environments Project
iNEMI Low Temperature Material Discovery and Characterization for First Level Interconnect Project
Переглядів 58Рік тому
iNEMI Low Temperature Material Discovery and Characterization for First Level Interconnect Project
iNEMI Smart Manufacturing Series: AI-Powered Solutions for Smart Manufacturing, ViTrox Corporation
Переглядів 204Рік тому
iNEMI Smart Manufacturing Series: AI-Powered Solutions for Smart Manufacturing, ViTrox Corporation
iNEMI Sustainable Electronics Webinar: Autonomous Industrial Monitoring-Vertical Farming and Beyond
Переглядів 67Рік тому
iNEMI Sustainable Electronics Webinar: Autonomous Industrial Monitoring-Vertical Farming and Beyond
iNEMI LCA Estimator Tool: Discussion and Q&A Session (January 17, 2023)
Переглядів 91Рік тому
iNEMI LCA Estimator Tool: Discussion and Q&A Session (January 17, 2023)
iNEMI Package Warpage Prediction and Characterization Project, Phase 6 (January 9, 2023)
Переглядів 130Рік тому
iNEMI Package Warpage Prediction and Characterization Project, Phase 6 (January 9, 2023)
iNEMI High Density Interconnect Socket Warpage Prediction Project (January 5, 2023)
Переглядів 55Рік тому
iNEMI High Density Interconnect Socket Warpage Prediction Project (January 5, 2023)
Call for Participation: iNEMI Hybrid PCBs for Next Generation Applications (December 7, 2022)
Переглядів 78Рік тому
Call for Participation: iNEMI Hybrid PCBs for Next Generation Applications (December 7, 2022)
Advances in Interconnect & Assembly Technologies for Next Generation Electronic Systems
Переглядів 2,7 тис.Рік тому
Advances in Interconnect & Assembly Technologies for Next Generation Electronic Systems
iNEMI Call-for-Participation Webinar: Conformal Coating Evaluation, Phase 3
Переглядів 31Рік тому
iNEMI Call-for-Participation Webinar: Conformal Coating Evaluation, Phase 3