iNEMI Packaging Tech Topic Series: Equipment Capabilities & Challenges to Support Advanced Packaging

August 20, 2024
Peter van Emmerik of Kulicke & Soffa Industries
This webinar focused on a fluxless thermo-compression bonding (TCB) process for chip-to-substrate and chip-to-wafer bonding that can eliminate the flux contamination/residue issues that limit the pitch of thermo-compression flip chip bonding - a serious problem for ultra-fine pitch interconnects. Fluxless TCB bonding is an extension of standard semiconductor assembly practices, does not require massive process and infrastructure changes as hybrid bonding does, and is in high-volume manufacturing.
Download the presentation: thor.inemi.org...