iNEMI High Density Interconnect Socket Warpage Prediction Project (January 5, 2023)

High density interconnect sockets are becoming larger, which creates challenges for socket warpage simulation and can impact SMT assembly yield and reliability. Expedited simulation computation that maintains the required level of accuracy is needed to shorten socket design cycles. Phase 2 of iNEMI’s High Density Interconnect Socket Warpage Prediction project builds on the analysis and validation framework for socket development established in Phase 1. In the second phase, the project will focus on improving socket warpage simulation accuracy and speed, further investigating the impact of molding and design on socket warpage, and ultimately establishing guidelines for dynamic socket warpage measurement and prediction. Click on the link below to download the presentation from the call-for-participation webinar.For additional project information:
www.inemi.org/...