iNEMI Packaging Tech Topic Series: "Role of EDA in Advanced Semiconductor Packaging"

Guest Speaker: Sang-Hyun Lee, Cadence Design Systems
May 20/21, 2024
The electronics industry is no longer able to rely on the economics of semiconductor logic scaling. Technology breakthroughs in semiconductor packaging are key to transforming chips into heterogeneous integration systems. Advanced multi-chiplet 3D packages have become a very attractive option for cost-sensitive complex designs, providing the best alternative to monolithic SoCs, but can present design challenges.
In this presentation Dr. Lee talked about EDA tools for integrated 3D-IC design, including multi-chip 3D-enabled tools that address co-design challenges such as the lack of a global view to optimize connectivity, and the need for a single integrated cockpit. These EDA tools provide an efficient way to start planning, designing and analyzing advanced semiconductor packaging.
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