I just had a 7 that had a shorted base band CPU. I identified the short with my Flir and found the power rail had a 7 ohm resistance to ground. I changed the "Qualcom" baseband CPU and the short went away. The phone was able to still boot and access the NAND. However it would just search for signal and never found the carrier. I totaled the phone but data recover was possible.
I missed the live stream, my question is, what would happen if instead of screwing the board down tightly it was left in a loosened state would these bendy problems be eliminated, obviously it would be done on a good working board before any bending occurs.
No... like I just alluded in another comment: floating this board would somewhat spread the stress (still having the designed focal point vulnerable), but create other problems, like at least ground and antenna integrity. The optimal approach for stress mitigation is encapsulation (like in optical fibre). Maybe in this case, with the hugely populated board, there are not enough anchor points (on top of the poorly designed structure) to defocus that stress. The easiest reliable approach I see for mobile phones, is what most companies do; expand the board in the parallel axis of the shape's stress focal point (that's why most other phones like Samsungs have squarish boards). The iPhone's narrow board is perpendicular to the focal point, creating this small area of maximum stress.
Nothing wrong with Jessa's humour imo. I just uploaded a video walking over the iPhone boards between 4 and 8, and point out why this iPhone 7 failure seems to occur along that line that Jessa refers to. Let me know what you think. Cheers
It is very sensitive to bad chargers and you have to be careful when changing battery not to damage the board, and now it may be slow-but it was a good phone
Hi Jessa. I read that Apple started using underfill in the iPhone 6/6 Plus after May 2016. Have you ever checked out a newer iPhone 6 and seen if this is true. Do you think Apple will secretly do this in the iPhone 7/7 Plus. Thanks
Would a helpful preventative measure be to replace the screws that are rigidly holding the board down with silicone so that the silicone can allow some flexion?
Integrated circuits including the packaging resist bending and flexing while the board is much more flexible. This is the primary reason why you have failure. Equipment that is designed to operate in rugged environments one of the primary things is a strong case and a board that is properly supported to prevent flexing even in the event of being dropped. Components with large footprints are also glue down to prevent the board flexing around that particular component as a means to strengthen the board from flexing and separating from the board.
Damn, this is probably what was wrong with my iPhone 7. My phone would randomly shut down and get stuck on a boot loop for up to a few hours at a time. Sometimes I could get to the home screen but the phone would usually lock up. And then about a week later my phone completely died and would not turn on. I was very pissed be yo was on vacation at the time and also I was very pissed about the fact that my iPhone 7 just ran out of its warranty 2 days before it died.
Jessa a quick, simple, and cheap substance to show cracking would be cooking sugar to "cracked" stage and pouring it thinly on the board.. Clean up is simple in an ultrasonic cleaner.
Just a thought for everyone to shoot down. First, the stress concentration along the "fault lines" is due to the metal of the SIM card receiver. So lets say the flexing causes the copper traces to cold work and form microscopic cracks. These traces rapidly change resistance during vibration, possibly reaching very high resistance levels for short periods. Think open circuits. These traces / circuit paths have inductors in series being used as filters. This is common. Inductors like to keep current constant as their magnetic fields collapse. When the resistance becomes high for an instant, the inductor generates a high enough voltage to "mend the open" in the trace while attempting to keep the current constant. Then it sends the higher voltage on to the base band processor, etc., frying it.
dear Jessa, my iphone 6s hangs after a while and does not work anymore, when this happens the display starts to gradually darken and the phone is not off and not on the network, everything is normal again after it is hard reset, this is it happens after an indefinite time, 1 hour 6 hours 8 hours, has been rewritten in dfu mode and nothing changes, what can I do to fix it? all the functions of the phone go perfectly until this happens.
I got my IPhone 7SE a month a go does mine have the same problem or is mine alright,can Apple not use a ceramic type circuit board that is a lot stronger or make the circuit board a lot thicker so that it doesn't flex any more or make the case of the IPhone from Aluminium and make the phone less likely to flex and I wouldn't mind a much heavier IPhone 7SE at all so what about it.
So if I have an iPhone 5 C with physical damage to the board will I have to transfer the CPU's and the Qualcomm and Ebomm chips and the NAND to the good logic board that I bought so the phone will appear to be the same phone that I had? and can I use the newer NAND Chip the is 32GB if I reprogram it with the NAND Pro???
Chris P yes spi ROM nand CPU Qualcomm not always if you can program the Nand and edit the spi when download the ROM and edit in winhex. Even this problem that Jessa mentioned can be fixed but you have to cut layers and find the line and disconnect then use uv glue with tiny coper wire to bypass the shorted section. This only work if the internal structure of the ic is not warped.
I am doubtful… stress fractures in silicon chips always lead to loss of signal (gaps disconnecting doted traces in the silicon crystal), and not in shorts.
The qcom mdm is just a modem. Why do you want to keep this "secure"? Keep it network looked or what? By the way. If you know the original serial of the modem you can fake it. It uses qmi protocol. Just tap into the right and generate fake responses.
You could actually cure some epoxy mixed in a way it becomes brittle. So you'd see the cracks and it can be 99% transparent unlike soldermask. Really good idea!
Where is the picture information stored on an iPhone 7. I know you said that you could not recover any data such as Baby picture and stuff. Is there a physical location where the information is stored??
So it is stored on the board Where in the CPU in the NAND Flash Chip there has to be a place. My question was not if I could access the Data my question was Where are the Photo's stored? Where is the IMIE Number stored? Where is the Boot information Stored? It's just a small ass computer but on a computer all the information is on the hard drive and the CPU controls the speed that information is transferred. Before windows you could access your .bat files and change your .bat files I know because I wanted to play a game on my computer and I had to get it to boot to the game. So where is the information stored????
So you are saying if I have a iPhone 5C 16GB that has a logic board with physical defects and I buy a good 5C Logic Board 32GB I can not transfer the IMIE Number from the 16GB board to the 32GB board? And you know this to be a fact you have tried to transfer an IMIE Number form one 5C logic board to another?
Sorry about that-started doing the video at the end of a 16 hour workday and I often don’t have enough RAM left in my brain to manage all the scene switching by then
With buck regulators if something goes bad with the feedback they may output full voltage on the rails which on some instances short the devices. The feedback traces are not power traces, so they could be really thin and easy to break. If the baseband chip is still alive, you could remove the coils, and power the rails externally. That would be my approach :P
Why is the base band CPU tied to the encryption and access of the NAND? Sure this will make it harder to get the data but come on its aes 256 your never going to break that anyway so why not just have a key that you can use to get the data off without having the basebad IC connected ? It works just fine on mac, have an encrypted but removable SSD just put it in another mac and your good to go.
Because Apple. I'd prefer an insecure NAND and recover the data even if something goes really wrong rather than loosing everything because of a design flaw. I beg even Apple can't recover any data once this happens. And they dont give a shit about you. It pisses me off.
Uhh, I’d rather a secure dead phone than a phone that someone can just take and duplicate. Yes Apple can’t recover your data, because it’s LOCKED with a secure code that they don’t have. It’s like saying to a stranger, hey have my house or car keys just in case I forget.
charlco Thing is, as told in the video, you need 4 chips to work properly in order to access the data. Plus, you can't replace one of those chips because they're "paired". There is A LOT that can go wrong, you have lots of chances to loose not only your phone, but your data. A password protected NAND flash would be good enough.
Depending on how shorted the rails are inside, the approach of trying to blow away the short by injecting a high current pulse does have a chance of working. Definitely worth a try if there'is nothing to lose. The trick is in applying only enough energy to blow away most of the short without creating a more conductive path of burnt carbon at the spot. It's unlikely the short will ever just go-away-completely. Best you can hope for is to reduce the resistance of the short to the point where you can inject the correct voltage at a somewhat higher current draw and hopefully get the phone to work for a while with the chip running hot from the energy running through the partial short. Of course, this assumes the short is in the connections from the IC package to the die, and not internal to the die. If the low voltage parts of the die got high voltage applied for long enough to damage them then its all over.
Couldn't you start an investigation the same way you repair SD cards? Sand down the top of a couple of chips until you expose the traces and take diode readings from inside the chip. Maybe even find a temporary work around that could at least retrieve the data?
Solder Joe The short version is No. SD cards have a tiny chip bonded to "large" traces. Modern ICs on the other hand use tiny, tiny, interconnects that would require a well equiped lab to work on to recover or patch around faults Chip makers could do it in their design and quality control labs, some universities could do it, and state actors could do it, but a small company would be looking at an absolute minimum of hundreds of thousands of dollars to get the equipment and set it up.
Tell the owner to take it to apple. They’ll replace it for free of charge, same thing happened to me. Wasn’t bootlooping but flashed from LTE to No Service, so i had the best of the issue at least.
Actually I believe this is not a mechanical problem, but an electrical one. Starting from the iPhone 6s, the frame is actually stiff enough, normal use should not stress the board and if the board is getting mechanical damage, the user is absolutely careless. This problem only happens on Qualcomm iPhone 7 because of the board arrangement, the chips or the wiring beneath is closer to the other high power chips on the other side of the board, which Apple did not design properly. Surging interference caused by other components will eventually fry the chip and your board will be dead sooner or later.
Tom Chai Why would the joints be cold, then? Perhaps Apple shipped them out poorly soldered. Even then if it there were true cold solder joints mechanical motion would break them anyways.
Keep in mind that the iPhone's board is narrow and so heavily populated that it does lack anchor points near these numerous intricate connections in all the 6 and newer designs (not X). The case's focal point is then perpendicular to the board's shape, creating a slim area of maximum stress. They might have gotten lucky with the 6s although the board looks more sound (pay attention at chip placement differences between the 6, 6s, and 7).
X-Ray the board to find cracks.. :) Find someone with access to a x-ray machine and ask if they are willing to x-ray some of these boards. I think you may be able to see any defects on the board/chip on a good x-ray. :)
With all due respect Jessa, do none of your clueless clients have backups of their iPhones to their primary computers? I mean, geez. I back up my iPhone, my wife’s and my kids iPhones once a month to my desktop. I’m fanatical about this PRIMARILY because Apple’s quality is so bad and predictable for failure. Thanks for a very informative video.
A fix would be nice but I can't help but wonder if there is anything we can do to prevent the fault ? I've not worked on enough devices to know if its sensible to take one with a working baseband, lift the appropriate chip and run wires directly to the pads on the chip, eliminating the solder balls thus decoupling that area of the chip from the source of stress. Any thoughts ?
i dont get it... the guy from strange parts, bought a deveice where you can put the mem chip of the iphone in. desolder and insert in to the thing. sorry for my english but isnt that a way he can get his photos back? you can than resolder it on to a new board? or copy it?
no as the cpu+baseband chip will generate a different key for each device and will not decrypt the contents of the nand unlike in the storage upgrade where they are simply transferring the data onto another nand.
Why not just to encrypt data without bending security features to the certain chips? If smn wanted the data he would just steel it with the phone. If the data is encrypted, the thief would need it to decrypt anyway. I do not see any point in bending such data to any specific device.
Hi Jesse, excellent video. It might be worth considering a couple more cases, firstly, the baseband chip could have loose balls and the tiny sparks as a result could be causing power surges in those circuits. Secondly, the problem you describe with the BB_PMIC could be also caused by the same scenario but instead of power surges they could be sparking and arcing out to the higher voltage pin you mention. Finally, Have you ever looked at decapping the baseband cpu to see if there are any replaceable components within? (Like the WiFi IC), I’ve personally not done it but might look at a donor board myself to see if there are any.
HilaKleiner don't be an idiot, I gave you a link to the exact product where it specifically says it is a modem it's not central processing unit nor system on a chip because it is not entire system on a chip it does not have more components like gpu DAC(other than modem conversion of signals), system RAM etc . those modem of course part of complicated modem design have sub components but those are part of the modem integral design to connect and communicate with different devices and networks. if you talk talk about SoCs look up for Exynos, Snapdragon lines of SoCs or apple A line which is the SoC in this device. and I don't care if it is 2017 or 2018 or what ever I care for clear definitions of the devices and you should look for too.
HilaKleiner of course a modem has controller inside that controls its internal signals almost every chip has a controller but that doesn't make it a SoC , as I said it has sub components that make up the modem but it is not a SoC by definition, if you want to know what is an SoC go read about it. dupe by woman you mean a troll ? I wasn't duped by anyone.
I was thinking about the flection problem is there any way the you could use slightly longer screws to hold the logic board to the housing and use small springs to fill the gap caused by the slightly longer screws. That way the logic board could not move as much as the case that surround's it. I just want to know if it could be possible? if you were to be able to communicate these issues to the people that engineer the iPhones. I am sure that Apple could send out a repair kit. Or is it impossible because of clearance issues within the iPhone 6, 7, & 8???
Simply floating the board would need several extra millimeters, spread the stress (still having the focal point vulnerable), and create other problems. The ideal approach for stress mitigation is encapsulation. Look at optical fibre. For mobile phones, the easiest sound approach is to expand the board in the parallel axis of the shape's stress focal point. That's why most other phones have square boards. On most iPhones the board's shape is perpendicular to the focal point, creating a small area of maximum stress.
Yukito Yukaza depends if you don't mind Google having your data and hovering up as much as they can find about you. Many don't give a damn, but some do.
Jessa does a very good job explaining these faults.
Very. I love Lois Rossman vids, but Jessa is much more thorough and less angry. ^^
Baseband ic is one of the most recurrent failures of the iPhone 7, after rebaling, I just don't screw the motherboard to the backplate.
Vincent Hernandez what about potting it
(I mean putting some epoxy on chip)
I just had a 7 that had a shorted base band CPU. I identified the short with my Flir and found the power rail had a 7 ohm resistance to ground. I changed the "Qualcom" baseband CPU and the short went away. The phone was able to still boot and access the NAND. However it would just search for signal and never found the carrier.
I totaled the phone but data recover was possible.
Absolutely love your work! Thanks for all you do!
I missed the live stream, my question is, what would happen if instead of screwing the board down tightly it was left in a loosened state would these bendy problems be eliminated, obviously it would be done on a good working board before any bending occurs.
So what you’re saying is-make the iPhone like a Samsung
iPad Rehab well answered....not huh!
No... like I just alluded in another comment: floating this board would somewhat spread the stress (still having the designed focal point vulnerable), but create other problems, like at least ground and antenna integrity.
The optimal approach for stress mitigation is encapsulation (like in optical fibre). Maybe in this case, with the hugely populated board, there are not enough anchor points (on top of the poorly designed structure) to defocus that stress.
The easiest reliable approach I see for mobile phones, is what most companies do; expand the board in the parallel axis of the shape's stress focal point (that's why most other phones like Samsungs have squarish boards).
The iPhone's narrow board is perpendicular to the focal point, creating this small area of maximum stress.
Gustavo Ferlizi thank you Gustavo, at least you gave a very intelligent reply unlike some
Nothing wrong with Jessa's humour imo. I just uploaded a video walking over the iPhone boards between 4 and 8, and point out why this iPhone 7 failure seems to occur along that line that Jessa refers to. Let me know what you think. Cheers
I love your videos when you get down like this. Very informative! Jessa the detechta.
Nice explanation Jessa! Where can i add to this list or compilation?
Are there any problems with the iPhone 5?
Not regarding to flex at least.
It is very sensitive to bad chargers and you have to be careful when changing battery not to damage the board, and now it may be slow-but it was a good phone
Am having a lot of iPhone 7and 7plus coming to shop with audio problem pre Attempt now the Phone has no modem firmware
got get folks to give the cheap guy enough bad reviews so that he goes out of business
Thank you dear Jessa
Hi Jessa. I read that Apple started using underfill in the iPhone 6/6 Plus after May 2016. Have you ever checked out a newer iPhone 6 and seen if this is true. Do you think Apple will secretly do this in the iPhone 7/7 Plus. Thanks
Does it happen with the 7 plus as well?
Would lead based solder being more flexible would you think that could slove the flection. Could that be a good prevention ?
Not necessarily. I just did a video with my rough reasoning as to why this is showing on the iPhone 7
Would a helpful preventative measure be to replace the screws that are rigidly holding the board down with silicone so that the silicone can allow some flexion?
No and maybe. You want to transfer board stress to the case, so it would need to be tighter if anything; or fully potted.
Integrated circuits including the packaging resist bending and flexing while the board is much more flexible. This is the primary reason why you have failure. Equipment that is designed to operate in rugged environments one of the primary things is a strong case and a board that is properly supported to prevent flexing even in the event of being dropped. Components with large footprints are also glue down to prevent the board flexing around that particular component as a means to strengthen the board from flexing and separating from the board.
how'd you get that shiner
i have iphone 6 ok i make softwere is coming 40 error any help
Hi Jessa, I ve got similar problem but phone jumps after 2 seconds from 60mA to 200mA and process starts again, I ve Got no idea what to do now
Damn, this is probably what was wrong with my iPhone 7. My phone would randomly shut down and get stuck on a boot loop for up to a few hours at a time. Sometimes I could get to the home screen but the phone would usually lock up. And then about a week later my phone completely died and would not turn on. I was very pissed be yo was on vacation at the time and also I was very pissed about the fact that my iPhone 7 just ran out of its warranty 2 days before it died.
Nice one a Jessa! Very well explained. I learned something :)
Definitely sharing this video around!
Jessa, I have a fairly reasonable hypothesis as to why this type of issue is back on the iPhone 7. I will do a video in the morning.
I just uploaded the video.
Jessa a quick, simple, and cheap substance to show cracking would be cooking sugar to "cracked" stage and pouring it thinly on the board.. Clean up is simple in an ultrasonic cleaner.
Or insert a stick and give logic board lollipop to kids
Good. Error 53 iphone x please thanks
Just a thought for everyone to shoot down. First, the stress concentration along the "fault lines" is due to the metal of the SIM card receiver. So lets say the flexing causes the copper traces to cold work and form microscopic cracks. These traces rapidly change resistance during vibration, possibly reaching very high resistance levels for short periods. Think open circuits.
These traces / circuit paths have inductors in series being used as filters. This is common. Inductors like to keep current constant as their magnetic fields collapse. When the resistance becomes high for an instant, the inductor generates a high enough voltage to "mend the open" in the trace while attempting to keep the current constant. Then it sends the higher voltage on to the base band processor, etc., frying it.
dear Jessa, my iphone 6s hangs after a while and does not work anymore, when this happens the display starts to gradually darken and the phone is not off and not on the network, everything is normal again after it is hard reset, this is it happens after an indefinite time, 1 hour 6 hours 8 hours, has been rewritten in dfu mode and nothing changes, what can I do to fix it? all the functions of the phone go perfectly until this happens.
I got my IPhone 7SE a month a go does mine have the same problem or is mine alright,can Apple not use a ceramic type circuit board that is a lot stronger or make the circuit board a lot thicker so that it doesn't flex any more or make the case of the IPhone from Aluminium and make the phone less likely to flex and I wouldn't mind a much heavier IPhone 7SE at all so what about it.
So if I have an iPhone 5 C with physical damage to the board will I have to transfer the CPU's and the Qualcomm and Ebomm chips and the NAND to the good logic board that I bought so the phone will appear to be the same phone that I had? and can I use the newer NAND Chip the is 32GB if I reprogram it with the NAND Pro???
Chris P yes spi ROM nand CPU Qualcomm not always if you can program the Nand and edit the spi when download the ROM and edit in winhex. Even this problem that Jessa mentioned can be fixed but you have to cut layers and find the line and disconnect then use uv glue with tiny coper wire to bypass the shorted section. This only work if the internal structure of the ic is not warped.
gigi morphe l
I am doubtful… stress fractures in silicon chips always lead to loss of signal (gaps disconnecting doted traces in the silicon crystal), and not in shorts.
The short comes from the pmic sending main voltage into cpu.
Oh you’re right - you even mention it in this video. My bad. Cheers!
The qcom mdm is just a modem. Why do you want to keep this "secure"? Keep it network looked or what? By the way. If you know the original serial of the modem you can fake it. It uses qmi protocol. Just tap into the right and generate fake responses.
to prevent original hardware from being replaced with compromised hardware especially one involved in data communication.
You could actually cure some epoxy mixed in a way it becomes brittle. So you'd see the cracks and it can be 99% transparent unlike soldermask. Really good idea!
Where is the picture information stored on an iPhone 7. I know you said that you could not recover any data such as Baby picture and stuff. Is there a physical location where the information is stored??
Even if you could (hypothetically) access that sector of the board, the data would still be encrypted.
Chris P it is encrypted, AES at 256 bit. unless you are Tony Stark you can't do shit
So it is stored on the board Where in the CPU in the NAND Flash Chip there has to be a place. My question was not if I could access the Data my question was Where are the Photo's stored? Where is the IMIE Number stored? Where is the Boot information Stored? It's just a small ass computer but on a computer all the information is on the hard drive and the CPU controls the speed that information is transferred. Before windows you could access your .bat files and change your .bat files I know because I wanted to play a game on my computer and I had to get it to boot to the game. So where is the information stored????
So you are saying if I have a iPhone 5C 16GB that has a logic board with physical defects and I buy a good 5C Logic Board 32GB I can not transfer the IMIE Number from the 16GB board to the 32GB board? And you know this to be a fact you have tried to transfer an IMIE Number form one 5C logic board to another?
Picture information is stored in the NAND. Encrypted.
If I can't eat the apple.
I don't buy the apple.
how r u frends i want help
Good explanation I think you forgot to switch to schematic when you explained where the fault is as I saw your eyes follow the mapping
Sorry about that-started doing the video at the end of a 16 hour workday and I often don’t have enough RAM left in my brain to manage all the scene switching by then
With buck regulators if something goes bad with the feedback they may output full voltage on the rails which on some instances short the devices. The feedback traces are not power traces, so they could be really thin and easy to break.
If the baseband chip is still alive, you could remove the coils, and power the rails externally.
That would be my approach :P
So coils do go bad! :O
You should find a fuse going bad and take it to Rossman.
Why is the base band CPU tied to the encryption and access of the NAND? Sure this will make it harder to get the data but come on its aes 256 your never going to break that anyway so why not just have a key that you can use to get the data off without having the basebad IC connected ? It works just fine on mac, have an encrypted but removable SSD just put it in another mac and your good to go.
Because Apple. I'd prefer an insecure NAND and recover the data even if something goes really wrong rather than loosing everything because of a design flaw. I beg even Apple can't recover any data once this happens. And they dont give a shit about you. It pisses me off.
Uhh, I’d rather a secure dead phone than a phone that someone can just take and duplicate. Yes Apple can’t recover your data, because it’s LOCKED with a secure code that they don’t have. It’s like saying to a stranger, hey have my house or car keys just in case I forget.
charlco Thing is, as told in the video, you need 4 chips to work properly in order to access the data. Plus, you can't replace one of those chips because they're "paired". There is A LOT that can go wrong, you have lots of chances to loose not only your phone, but your data. A password protected NAND flash would be good enough.
yeah, use some encryption, then you can only access the data with the consent of the owner
Depending on how shorted the rails are inside, the approach of trying to blow away the short by injecting a high current pulse does have a chance of working. Definitely worth a try if there'is nothing to lose.
The trick is in applying only enough energy to blow away most of the short without creating a more conductive path of burnt carbon at the spot.
It's unlikely the short will ever just go-away-completely. Best you can hope for is to reduce the resistance of the short to the point where you can inject the correct voltage at a somewhat higher current draw and hopefully get the phone to work for a while with the chip running hot from the energy running through the partial short.
Of course, this assumes the short is in the connections from the IC package to the die, and not internal to the die. If the low voltage parts of the die got high voltage applied for long enough to damage them then its all over.
Extremely unlikely to work. A chip of that size with those many pins has less than 30 micron between each die connection.
Torsional stress you mean? :)
But you are wrong jessa there is way that you can get only data back from dead baseband cpu
I have same problem in my iphone 6 plus
It also booting repeatly.
My phone get 20 volt by faulty charger.
Battery is good.
Please help me
Couldn't you start an investigation the same way you repair SD cards? Sand down the top of a couple of chips until you expose the traces and take diode readings from inside the chip. Maybe even find a temporary work around that could at least retrieve the data?
Solder Joe The short version is No. SD cards have a tiny chip bonded to "large" traces. Modern ICs on the other hand use tiny, tiny, interconnects that would require a well equiped lab to work on to recover or patch around faults
Chip makers could do it in their design and quality control labs, some universities could do it, and state actors could do it, but a small company would be looking at an absolute minimum of hundreds of thousands of dollars to get the equipment and set it up.
iPhone memory is encrypted
I from Brazil and I in the work working in iphone 8 no service
Tell the owner to take it to apple. They’ll replace it for free of charge, same thing happened to me. Wasn’t bootlooping but flashed from LTE to No Service, so i had the best of the issue at least.
either your kidding or your an Apple fanboy, buy you cant be serious.
Actually I believe this is not a mechanical problem, but an electrical one. Starting from the iPhone 6s, the frame is actually stiff enough, normal use should not stress the board and if the board is getting mechanical damage, the user is absolutely careless.
This problem only happens on Qualcomm iPhone 7 because of the board arrangement, the chips or the wiring beneath is closer to the other high power chips on the other side of the board, which Apple did not design properly. Surging interference caused by other components will eventually fry the chip and your board will be dead sooner or later.
Tom Chai Why would the joints be cold, then? Perhaps Apple shipped them out poorly soldered. Even then if it there were true cold solder joints mechanical motion would break them anyways.
Keep in mind that the iPhone's board is narrow and so heavily populated that it does lack anchor points near these numerous intricate connections in all the 6 and newer designs (not X). The case's focal point is then perpendicular to the board's shape, creating a slim area of maximum stress. They might have gotten lucky with the 6s although the board looks more sound (pay attention at chip placement differences between the 6, 6s, and 7).
Tom, look at the video I just did and let me know what you think of my reasoning around stress relief of these boards
I tell every one to install Google photos before your phone goes bad so you can recover your data
That was a master-class. I think Tailosive on Tailosive Tech should watch this video as he may learn something.
Why do I feel like iPhone 8 , 8plus and iPhone X will have this problem next
X-Ray the board to find cracks.. :) Find someone with access to a x-ray machine and ask if they are willing to x-ray some of these boards. I think you may be able to see any defects on the board/chip on a good x-ray. :)
With all due respect Jessa, do none of your clueless clients have backups of their iPhones to their primary computers? I mean, geez. I back up my iPhone, my wife’s and my kids iPhones once a month to my desktop. I’m fanatical about this PRIMARILY because Apple’s quality is so bad and predictable for failure. Thanks for a very informative video.
Most assume everything has been backing up to cloud or google photos but find out it hasn’t
A fix would be nice but I can't help but wonder if there is anything we can do to prevent the fault ?
I've not worked on enough devices to know if its sensible to take one with a working baseband, lift the appropriate chip and run wires directly to the pads on the chip, eliminating the solder balls thus decoupling that area of the chip from the source of stress. Any thoughts ?
Pot the whole device in resin.
i dont get it... the guy from strange parts, bought a deveice where you can put the mem chip of the iphone in. desolder and insert in to the thing. sorry for my english but isnt that a way he can get his photos back? you can than resolder it on to a new board? or copy it?
no as the cpu+baseband chip will generate a different key for each device and will not decrypt the contents of the nand unlike in the storage upgrade where they are simply transferring the data onto another nand.
James Mike aaaa okey, thanks!
and why you people complain about that? I'm happy to fix them.This kind of faults keep our business running and we should be grateful Apple for that.
Why not just to encrypt data without bending security features to the certain chips? If smn wanted the data he would just steel it with the phone. If the data is encrypted, the thief would need it to decrypt anyway. I do not see any point in bending such data to any specific device.
Nice!
Her shirt is ironic in that she doesn't use hers.. Then coins her own asinine term that makes no sense.
Hi Jesse, excellent video. It might be worth considering a couple more cases, firstly, the baseband chip could have loose balls and the tiny sparks as a result could be causing power surges in those circuits. Secondly, the problem you describe with the BB_PMIC could be also caused by the same scenario but instead of power surges they could be sparking and arcing out to the higher voltage pin you mention.
Finally, Have you ever looked at decapping the baseband cpu to see if there are any replaceable components within? (Like the WiFi IC), I’ve personally not done it but might look at a donor board myself to see if there are any.
you are the best
let Apple make the same housing as the iPhone 5 for the iPhone 6 7 and 8 you have no longer bent housing any more.
Boot loop sounds like fruit loops
This is not actually a cpu but a modem
Eliad Buchnik Qualcomm refers to the management CPU that controls the wireless radios (cellular, wifi, bluetooth) as the baseband processor.
It's both; a system-on-a-chip modem.
HilaKleiner don't be an idiot, I gave you a link to the exact product where it specifically says it is a modem
it's not central processing unit nor system on a chip because it is not entire system on a chip it does not have more components like gpu DAC(other than modem conversion of signals), system RAM etc . those modem of course part of complicated modem design have sub components but those are part of the modem integral design to connect and communicate with different devices and networks. if you talk talk about SoCs look up for Exynos, Snapdragon lines of SoCs or apple A line which is the SoC in this device. and I don't care if it is 2017 or 2018 or what ever I care for clear definitions of the devices and you should look for too.
HilaKleiner of course a modem has controller inside that controls its internal signals almost every chip has a controller but that doesn't make it a SoC , as I said it has sub components that make up the modem but it is not a SoC by definition, if you want to know what is an SoC go read about it. dupe by woman you mean a troll ? I wasn't duped by anyone.
how so?
Buy an iphone se and avoid all these problems and save a shit ton of money
I was thinking about the flection problem is there any way the you could use slightly longer screws to hold the logic board to the housing and use small springs to fill the gap caused by the slightly longer screws. That way the logic board could not move as much as the case that surround's it. I just want to know if it could be possible? if you were to be able to communicate these issues to the people that engineer the iPhones. I am sure that Apple could send out a repair kit. Or is it impossible because of clearance issues within the iPhone 6, 7, & 8???
Chris P They don't design the iPhone with enough space inside to do this, they could it might only take up .5mm but they won't.
Simply floating the board would need several extra millimeters, spread the stress (still having the focal point vulnerable), and create other problems.
The ideal approach for stress mitigation is encapsulation. Look at optical fibre.
For mobile phones, the easiest sound approach is to expand the board in the parallel axis of the shape's stress focal point. That's why most other phones have square boards.
On most iPhones the board's shape is perpendicular to the focal point, creating a small area of maximum stress.
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People need to learn how to use iCloud better so they don’t lose their pictures
Or they can switch to an Android with an SD card.
or use google photos is automatically backups photos and videos and available for both iOS and android.
Yukito Yukaza depends if you don't mind Google having your data and hovering up as much as they can find about you.
Many don't give a damn, but some do.
And now I understand why Xiaomi used in the all-new Redmi 6 smartphones Mediatek SoC's instead of Snapdragon SoC's.
Nice baby
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I bet the Norwegian repair shops can fix it! Oh snap!