2023 ERI Summit: 3D IC EDA: What is Needed, and How/When Can We Deliver? (Kim)
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- Опубліковано 18 вер 2023
- Dr. WooPoung Kim, Corporate EVP and Head of Packaging Solutions Center of Samsung USA, presents "Low-Cost & Design-flexible 3D-IC Packaging Solutions."
- Наука та технологія
