Semiconductor Packaging - PACKAGE STRUCTURE

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  • Опубліковано 20 гру 2024

КОМЕНТАРІ • 7

  • @hustladen1
    @hustladen1 9 місяців тому

    amazing, this is the third video I watch on this channel and all of them with 100% attention

  • @cayseinlow4879
    @cayseinlow4879 2 роки тому

    Thanks for your informative introduction. Looking forward to more!

  • @dennisbocalbos5973
    @dennisbocalbos5973 2 роки тому

    Informative ......keep it up.😃😃😃

  • @sheveklin
    @sheveklin Рік тому +1

    Thanks for the informative video! Can you share more about the flip chip structure, and how it works?

  • @hassanfasel2042
    @hassanfasel2042 Рік тому

    Is this same packaging structure used for wbg semiconductor?

    • @watchlearnnplay
      @watchlearnnplay  Рік тому +1

      Yes this is one of them. But note that selection of package type is driven by device application. A single device type can be packaged in many different ways depending on target market application.