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WATCH LEARN 'N PLAY
Canada
Приєднався 22 сер 2020
Sharing learning videos related to semiconductor assembly (packaging) processes and manufacturing / process engineering in general. Videos are manufacturing process oriented based on actual hands-on experience of the author.
Will also share information on important and interesting topics in technology, social issues, current events, travel, and anything under the sun that is worth learning.
And don't forget to chill and relax so I'll be uploading karaoke videos for everybody as well. Sing 4 Fun!
Check my LinkedIn page for consulting needs - LG Learning & Engineering Services
Will also share information on important and interesting topics in technology, social issues, current events, travel, and anything under the sun that is worth learning.
And don't forget to chill and relax so I'll be uploading karaoke videos for everybody as well. Sing 4 Fun!
Check my LinkedIn page for consulting needs - LG Learning & Engineering Services
Semiconductor Packaging - Introduction to Molding Process
This is a semiconductor packaging learning video - an introduction to transfer molding and compression molding process for semiconductor devices.
Переглядів: 1 303
Відео
INTRODUCTION TO FLIP CHIP TECHNOLOGY
Переглядів 10 тис.7 місяців тому
This is a learning video about flip chip technology and its application in advanced packaging of integrated circuits (IC).
Wire Bonding Techniques
Переглядів 10 тис.Рік тому
Another wire bonding learning video from Watch Learn 'N Play channel. This video will discuss about reverse bonding and BSOB / SSB which are very important and useful wire bonding techniques for advanced semiconductor packaging.
DIE ATTACH PROCESS
Переглядів 16 тис.Рік тому
Die attach is a process step of semiconductor packaging (assembly). This is video is a die attach process overview for beginners. This video is created and published by Watch Learn 'N Play channel ( @watchlearnnplay ) as part of semiconductor packaging learning video series. This video is intended for beginners. Thank you for watching!
PACKAGING SEMICONDUCTOR DISCRETE DEVICES
Переглядів 2,3 тис.Рік тому
Discrete semiconductor devices such as diode, bipolar junction transistor (BJT) and MOSFET. Packaging Semiconductor Discrete Devices talks about various packaging types or options for both low / medium power and high power discrete devices.
WIRE BONDING (PART 2)
Переглядів 15 тис.Рік тому
Wire bonding (wirebonding) is a process step of semiconductor packaging (assembly). This is part 2 of learning video related to wire bonding process ( ball bonding ) using gold wire. You will learn in this video key things in wire bonding process such as properties of bonding pad, capillary ( bonding tool ) design and how it affects first bond (bonded ball), second bond ( stitch / wedge ), and ...
WIRE BONDING (PART 1)
Переглядів 31 тис.Рік тому
Wire bonding (wirebonding) is a process step of semiconductor packaging (assembly). This is part 1 of learning video related to wire bonding process using gold wire ( ball bonding ). You will learn in this video the basics in wire bonding process including bonding cycles, bond parameters for 1st bond ( bonded ball ), 2nd bond ( stitch bond ), and wire loop or loop height. This video is created ...
WAFER SAW
Переглядів 18 тис.2 роки тому
This is a learning video related to wafer saw process which is the first process step in semiconductor packaging. You will learn in this video key topics such as wafer mount tapes, dicing blades, saw process parameters, and dicing quality. This video is published by Watch Learn 'N Play channel as part of semiconductor packaging learning video series. Thank you for watching!
Semiconductor Packaging - PACKAGE STRUCTURE
Переглядів 7 тис.2 роки тому
A short video on common semiconductor package structure in preparation for future learning videos related to specific processes such as wafer saw, die attach, and wire bond that will be shared in this channel.
Semiconductor Packaging - ASSEMBLY PROCESS FLOW
Переглядів 121 тис.2 роки тому
This is a learning video about semiconductor packaging process flow. This is a good starting point for beginners. - Watch Learn 'N Play UPDATE 8/15/2022: FIXED ENGLISH SUBTITLE. PLEASE USE SUBTITLE IF YOU CANNOT UNDERSTAND MY ACCENT (PARDON MY ACCENT AND MY GRAMMAR TOO :) )
Introduction to Semiconductor Packaging
Переглядів 20 тис.3 роки тому
Introduction to Semiconductor Packaging talks about different semiconductor package types. A good starting point for students, beginners, and also for those who are just curious, especially fresh graduates who wants to explore semiconductor packaging industry. Please like, share, and leave your comments. Appreciate your feedback and don't forget to subscribe if you like the video. More knowledg...
Can you create more videos about semiconductor process?
very good process introduction and easy to comprehend, thank you so much !
really informative and good explanations. thank you very much for this useful vidios
excellent Video
Nice video, keep it up, bro
Thanks for the Video! In my Bonding process, the stitch is extremely weak and looks like in Bond Visual Quality "Weak 2nd bond", but the whole capillary impression is visible. Its just the fishtail that looks fragile. I allrady tried to fix it by varying the Bond Force and US Time parameter, can you imagine, where the issue is?
There are several possibilities,but without technical details I cannot really give a proper device. What's the pull test numbers?
@@watchlearnnplay i have got a pull test device, that only measures forces >25mN, and those Stitches are far away from that, so the force is never bigger than 25mN. It seems like even when i touch them a little bit with the Hook, they loosen from the Goldpad. The Wire doesnt even deform to the "triangle-form" when pulling on it, the stitch just loosens and i lift the bond. So, the stitch is extremely weak. ps: Thanks for your quick answer!
If you can send some photos of the 2nd bond, capillary dimension, wire diameter then I maybe able to help you
@@watchlearnnplay i’ve sent you an email :)
I replied to your email. I hope it helps.
Practical video
Very good information. Thanks for sharing.
Thank you so much for the sharing! SALUTE from an FE engineer.
Semiconductor assembler here...
thank you
hi can you made a video on clip bonding?
Superb video. Need more of Kind of videos in IC packaging. Your Doing excellent videos. Keep on posting new videos.
i worked as a operator in diff.semiconductor before n i hve learn a lot from it...from phil.to taiwan semiconductor cmpny...i was also become a wrbond operator n a programer in a long run become a technician only for a work expiriencr
Thank you very much. Very informative. God bless
Thank you so much for sharing knowledge 👍👍👍 wish you have good things and success in life.
How about parametric in asm gocu or aero, new subscriber. Thank you sir.
256 pin count is the 7th quadrant in my algorithm.
So helpful I hope you can continue making videos
Love the deep detail. Been looking for something like this for a long time. Always wondered what force was applied to the wire in order for it to melt enough to bond. Ultrasonic was not what I expected but it makes sense in minimizing thermal movement. Cool stuff.
Is there any way to know the expected ball size by Capillary?
If you mean mashed ball dia, it will be slightly bigger than your capillary CD. But you need to correctly set your FAB diameter to achieve your target MBD. This topic is covered in wire bonding part 2 video
@@watchlearnnplay I saw the story, too
@@watchlearnnplay Is there a separate formula?
Hi. May I know what is the rootcause that the Swing wire short to each other during after complete running, 1 strip found 1 & 2 unit short only.????
Hard to tell with the limited information you gave. But here's my input. Is it happening on every strip and localized location on the strip? If it is then it may be the window clamp that is touching the wire when it opens up after bonding and prior indexing or during indexing. If you are using tape to compensate clamping then it is likely to happen when tape is already coming off. And if there is sign of mechanical contact on the wire then check other moving parts after bomding particularly the ejector to output magazine. I hope this helps.
perfect thank you!♥
Nice LGALE 😂
Thank you so much.
Bapak pamudjiid
this is great.
wire bonding temperature plz
150C to 240C depending on your device, leadframe / substrate and bonding machine. For room temp bonding you can use Al wedge bonding process
@@watchlearnnplay Is the higher the temperature, the better?
I have a lot of questions. Please let me know your e-mail
You can message me thru my linkedin account
For bonding, higher temp the better. But not all materials are good at high temp.
Hi, can you also do the video explaining the IC packaging molding process and also the lead plating process? This is my humble request. Really appreciate if you can do it. Thank you! Your video helps me a lot! ^^
Sure I will
Thanks!
The best illustration Semiconductors wafer, chips and devices such as transisors. I hope this discussion be extended to Field effects transistors such as MOSFETS, POSFETS, and Biosensors.
awesome 🤩
Thank you so much for technical details. Clear and sound!
I am still not very clear on how the bond wire is attached to the bond pad and the LF. Could you please provide additional explanation?
You can get that information in Part 1 video. Thanks for watching.
How can I do DOE of Wire bonding process? What is the main key factor?
Main or key parameters are bond force, power, and time. But DOE for wire bonding is more than just knowing the main parameters. Have fun on your DOE.
amazing, this is the third video I watch on this channel and all of them with 100% attention
Very informative, thank you
worked at kyocera as a process tech in the packaging department wirebonding old technology 😀
I watched this on my phone while my teacher is presenting this
Happy to know that my video is useful for teaching / learning.
I took a trade course (I'm from Southern New Hampshire) at a community college called the Microelectronics Bootcamp. We learned wire and ribbon bonding, die attach, MILSTD-883, and rework. I graduated at the top of my class and came back to help teach it while landing jobs at various defense manufacturers and becoming the head of the rework dept for BAE Systems on my shift, although I've since left the field. Micro was my passion and this series, IMO, is an excellent production of bonding knowledge! Thank you for this content💕
Wire bonding miss ball problem
Thanks for sharing!
Thanks for sharing your knowledge!
Thank you for making detailed video. Is DIE attached with wafer tape?
I'm glad I watched this *after* I delidded my CPU to apply new TIC to the die. I would've felt like I was diffusing a bomb.
Hi sir good day can i ask something about Multi Stage parameters what is that for? And why they put that application in tool usage application
do you mean segmented parameters for 1st bond or ssb? if the device is unstable, segmented is ideal.
Great video! 👍
Thank you very much for making impressive video. This is absolutely perfect video due to you also add up real processing video including illustrator. I work for semiconductor industry for 16yrs still surprise the way you make video presentation. Please keep going.
Thank you very much for your informative about WB sharing. I have learnt a lot from your video part1 part2 hopefully that you will make a fantastic video again and again
Please provide information regarding micro bump and hybrid bonding in 3D ICs