[Eng Sub] TSV (Through Silicon Via) - HBM, Silicon Interposer, CMOS Image Sensor, MEMS

Semiconductor packaging technology for high performance application. It is usually used for high performance computing.

[@haoxu4328]

As a Bosch employee, I was really happy to hear that such a cool process was named after our company. Thank you for your videos, from which I can always learn a lot.

[@semicontalk3223]

Thanks for watching and that is a privilege for the company who pioneered new technology.

[@shs2533]

언제나 잘보고 있습니다. 제가 영어 실력을 많이 늘려야 겠네요. ㅋ

[@semicontalk3223]

시청해주셔서 감사합니다. 저도 매일 영어공부 하는데 쉽지 않네요 ^-^;;;

[@vincentwong4581]

Thank you so much for all these videos! So informative! Btw can you do a video on RDL as well?

[@semicontalk3223]

Thanks for watching. Please check below my videos and you will get some information about RDL.
[Eng Sub] Wafer Level Chip Scale Package (WLCSP)
ua-cam.com/video/F0WLyZZDyeo/v-deo.html
[Eng Sub] Fan Out Wafer Level Package: Apple iPhone, TSMC InFO, Qualcomm
ua-cam.com/video/R7ssguwtef4/v-deo.html

[@vincentwong4581]

Spot on thank you ☺️

[@shahzaibali7768]

Can I get this ppt?

[@semicontalk3223]

I am afraid that I can't share ppt.

[@KRISHNAPALL-jy1df]

Hi