ASE FOCoS-Bridge Introduction

Positioned under the ASE VIPack™ platform, this FOCoS-Bridge technology is designed to be highly scalable, enabling seamless integration into complex chip architectures while delivering high density die-to-die (D2D) connections, high input/output (I/O) counts, and high-speed signal transmission for evolving Artificial Intelligence (AI) and High-Performance Compute (HPC) requirements.
FOCoS-Bridge是日月光VIPack™平台六大核心封裝技術支柱之一，旨在實現高度可擴展性，無縫集成到複雜的晶片架構中，同時提供高密度晶片對晶片連接(D2D)、高I/O數量和高速信號傳輸，以滿足不斷發展的人工智能(AI)和高效能運算(HPC)需求。
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★ About ASE FOCoS-Bridge : ase.aseglobal....
★ 更多關於日月光 FOCoS-Bridge : ase.aseglobal....