#FMD

Short information:
Integrated, certified production line for the processing of individual #SiC-based prototype devices
Front-end (wafer sizes of 100 mm and 150 mm): all process steps e.g. #epitaxy, #ICP dry etching, growth of silicon dioxide, aluminum implantation at elevated temperatures, activation tempering or conductive contact alloy
Back-end: new integration technologies and innovative assembly and system concepts for #prototyping
Possibility to realize particularly complex and compact structures, heavily stressed (special) applications with small quantities or durable high-temperature #power electronic modules
Our FMD = 13 institutes. EUR 284.5 million investment until the end of 2019 enabled 215 equipment installations and thus the improvement and renewal of the research infrastructure of our member institutes.
More Information on Fraunhofer IISB competences´ within FMD: www.iisb.fraun...
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