Dicing saw for semiconductor industry / Silicon wafer cutting / wafer sawing

Application:IC,Optical,communication,LED,MEMS,Medical,NTC,Quartz,Diode,Triode etc.
Material suitable: Si,GaAsLiNbO3,Al2O3,Ceramic,Glass,Quartz,PCB,EMC etc.
If you want to konw more, contact our engineer:
【Minder Hu】
WeChat/Whatsup: 15813334038
Email:
[e-mail]
[e-mail]