BEEE 3814 Wafer Mounter and Wafer Sawing Process

Notes on Industrial Semiconductor Process

[@muckeshraj1636]

Well explained sir... thank you very much for ur effort sir...

[@osentinela1435]

Perhaps a new triangle processor architecture, which would increase the density per area and solve the problem of dei scaling in wafer manufacturing! No need to cut the wafer as it would be a single circular die with 25 mm diameter, increasing the capacity by increasing the size of the circular wafer die!

[@nurhanannia4102]

thank you sir, good knowledge

[@ainainsyirah7174]

Thank you sir for the knowledge

[@sitirabiatul7254]

Thanks n very good information 👍

[@gernhardtreinholzen4606]

nice video. basically, there is a third technology: plasma dicing (dicing by etching)

[@mohdsyahrinamrimohdnoh7226]

Tq ..I didnt get the chance to use the plasma dicing. Thanks for sharing the info.

[@amninurzafirah1882]

thank you sire very easy to understand

[@maizatulhanim7014]

thank you sir

[@NurulHasanah-cv1sf]

Thank you Sir

[@nurazimah8977]

Thank you sir.

[@ainunnabihah8744]

Thank you sir for the information, good knowledge

[@haziqhanafi8750]

Thankyou sir

[@nellymastion802]

Thankyou sir.

[@syahirahzamri6790]

Thank you

[@mamatlimasatu]

Thank you for the explanation sir

[@c.n.gb3rry]

Done. Thank you sir

[@pavitraanandarao9469]

Useful video.. Thank you.

[@muhamadhakim9697]

Rindunya nk pegang wafer😣😢

[@chaigf1652]

Done thank you

[@damien8350]

Understood. Thank you

[@salwaniematnasir3759]

Thank you👍🏻

[@fodekediakhe549]

Hello sir, I have a problem with cutting and I'm having trouble solving it. in fact the finish of the cut at the edge is clean because the gold (electrolyte) on the rear face folds. I tried changing the cutting depth as well as the feed speed but the problem still persists.
Thanks for your feedback.
Sincerely

[@ahmadfaiqul1457]

Thank you..

[@hazriealkhusyairie7118]

good explanation sir 🤓

[@navapragashennaeer4470]

done sir thank you

[@syerayusri5312]

Good information

[@Teacher_JINU]

Nowadays, companies don't use wafer sawing machines, They prefer Lazer machines as I know, but I got a job which position is sawing part of semiconductor about battery . COULD you give me some advice about this job it is good or not for my Career??

[@mohdsyahrinamrimohdnoh7226]

laser sawing is expensive and some company will use only on critical device. I did published some paper on using laser sawing combine with mechanical dicing to eliminate the chipping touching on active area for 60um saw street. Sawing is an intresting process and I really enjoyed it. Hope you enjoy your job as well.

[@liangzhaothirotay7554]

Thank you, Sir.

[@muhdikram6858]

done, tq sir

[@shhiiinnnn]

Done sir. Thank you

[@jurawarsingh6964]

Hi bro could please upload more videos about disco package saw

[@mohdsyahrinamrimohdnoh7226]

I do not have package saw in my place. The concept is the same. The only different is wafer saw using hub blade while package saw is using hubless blade.

[@adilahyahya9465]

Thankyou and done

[@hilmimujahid823]

good

[@noratikah1903]

👍

[@fodekediakhe549]

Well explained sir, please witch parameter we must modified for reproduction of dual passe with a single blade. Thank you.

[@mohdsyahrinamrimohdnoh7226]

For chipping performance you can evaluate the first cut depth, Feedspeed and Blade RPM which suits your wafer performance.

[@fodekediakhe549]

hello sir, thank you for your feedback. in fact my problem is that I can't do the dual pass test as you explained. for example if I have to cut 10 lines on the 90 angle. it first does all 10 lines with a depth d1 which allows cutting only on the plate then it repeats the same operation on the lines already cut with a depth d2.

[@fodekediakhe549]

I would like to know how to adapt my program, so that the blade cuts a line with the two depths d1 then d2 before passing the next line. as explained in your video. Thanks for your feedback

[@fodekediakhe549]

Can we saw silicon wafer with 25 RPM?

[@mohdsyahrinamrimohdnoh7226]

The best is to perform DOE. It depends on the cutting method you are using whether single cut or step cut or dual pass as well. In basic, higher blade RPM produce lower topside chipping but resulting to higher backside chipping. In wafer sawing, parameter it is not only blade RPM plays a role, feed speed, blade height, cutting method and different wafer material and structure on sawing street will provide you different result, thus DOE is require for your device to get the best chipping output. For chipping free activities you could refer to my paper "Chipping free process for combination of narrow saw street (60um) and thick wafer (600um) sawing process".

[@fodekediakhe549]

Thanks for your feedback

[@azrulfahmi7091]

Thank you

[@ezatulalia9984]

Done. Thank you sir

[@nursyahirah2076]

Thank you 👍🏻

[@laxmiganthanmuniandy7171]

thank you

[@muhdirsyaduddin2144]

Thank You

[@cindyhuring6566]

Thank you

[@adlihakeem4169]

Thank you

[@nurnajwaamani1315]

Done. Thank you sir

[@yanathirahsaid9453]

Done, thankyou sir

[@Chongweisingapore]

Thank you

[@nurulsyahira1312]

Done. Thank you sir

[@muhamadhakim9697]

Sama2