So i have a question... Just to clarify: what thermal pads thickness did you use? 0,5mm on the ram, 1mm on the die cover next to heat pipe, right? But what thickness on the heat pipe? You didn't mention this one ☠️☠️
I did similar cooling mods when I chipped my late v1. I'm about to order an aluminum backplate to increase thermal contact/dissipation and I would love to see a video of the improvements. Your video helps me move forward in my project Thank you
I've read that using an aluminum backplate will essentially create a pseudo-faraday cage around the Switch and cause problems connecting with the joycons.
Hello there, now after 5months++ of usage, could you do a comparison again? From what I've read, the spec for PTM7950 gets better overtime, so really eager with the result
That last chip you covered with the PTM is the NAND. Do you consider repasting the SoC itself underneath the shielding? I did it to my V1 switch basically out of the box (and again 2 months ago when I got hold of some high performance .5mm thermal pads for the RAM) and the fan noise was never a problem but I'm yet to overclock it.
Oh the NAND I put thermal pad not paste. Only put ptm on the apu There isn’t any need to go underneath the copper from what I can tell. Just going on top allows proper contact between the SOC and the cooling unit
@@TechGuyBeauYou should try remove that copper shim entirely and putting the ptm pad directly between the heatsink and cpu die, ive done that on my switch with paste and then fan hardly even turns on half the time
@@NO_obsI believe the ptm pad is too thin to make contact with the apu and copper shim. However, it should be repasted under there with quality paste.
So i have a question...
Just to clarify: what thermal pads thickness did you use?
0,5mm on the ram, 1mm on the die cover next to heat pipe, right?
But what thickness on the heat pipe? You didn't mention this one ☠️☠️
I did similar cooling mods when I chipped my late v1. I'm about to order an aluminum backplate to increase thermal contact/dissipation and I would love to see a video of the improvements. Your video helps me move forward in my project Thank you
I've read that using an aluminum backplate will essentially create a pseudo-faraday cage around the Switch and cause problems connecting with the joycons.
Hello there, now after 5months++ of usage, could you do a comparison again? From what I've read, the spec for PTM7950 gets better overtime, so really eager with the result
well that settles it, I'm doing this to my daughter's lite .
That last chip you covered with the PTM is the NAND. Do you consider repasting the SoC itself underneath the shielding? I did it to my V1 switch basically out of the box (and again 2 months ago when I got hold of some high performance .5mm thermal pads for the RAM) and the fan noise was never a problem but I'm yet to overclock it.
Oh the NAND I put thermal pad not paste. Only put ptm on the apu
There isn’t any need to go underneath the copper from what I can tell. Just going on top allows proper contact between the SOC and the cooling unit
@@TechGuyBeauYou should try remove that copper shim entirely and putting the ptm pad directly between the heatsink and cpu die, ive done that on my switch with paste and then fan hardly even turns on half the time
@@NO_obsI believe the ptm pad is too thin to make contact with the apu and copper shim. However, it should be repasted under there with quality paste.
What method did you use to remove the foam that has the adhesive sticking to the fan?
Rage
@@TechGuyBeau sounds about right
How difficult would you say it is to this as someone who has never done this before. Need to do it since I had my switch since 2018
Super easy on the Nintendo switu
Do the average 50 degree of the switch even suffice to 'cure' these
Yes it just takes a really really long time