Better Electronics Enclosure Design with Thermal Simulation

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  • Опубліковано 4 сер 2024
  • In this short webinar, we take a look at how heat transfer or thermal simulation helps FEA engineers or electrical engineers to better anticipate the thermal behavior of an electronics enclosure without the use of complex CFD simulations.
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  • Наука та технологія

КОМЕНТАРІ • 1

  • @Wuuser
    @Wuuser 6 років тому +1

    Well done webinar, thanks!