3. Packaging process technology Pretending to be a Sniffing Spot for Hybrid Bonding

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  • Опубліковано 3 січ 2025

КОМЕНТАРІ • 6

  • @parnikagupta1624
    @parnikagupta1624 5 місяців тому +3

    Sincere thanks for putting the videos in english. Its very useful for new integration engineers.

  • @leongsengcheong4194
    @leongsengcheong4194 Рік тому +2

    Appreciate that you are publishing videos in English 😊 greetings from a young process integration engineer in Singapore, just trying to learn more about future trend of semiconductor industry, and I find your videos very insightful

    • @王不老說半导
      @王不老說半导  Рік тому

      Love your comment. Those are exactly why I publish those works, i.e., helping out new engineers (I wish I were to have these helps when I just entered this biz twenty some yrs ago).

  • @mizunommjp
    @mizunommjp Рік тому +1

    5 days ago, you said there would be no more 2 different equations for yield to avoid confusion.
    The video you just posted has again the 2 different equations.
    y(A)= (1+A*1.15/2)^-2
    y(A)= (1+A*0.223/2)^-2
    Your viewers get more confused.

    • @王不老說半导
      @王不老說半导  Рік тому

      You're correct. Mybad! I only mentioned it verbally in the video that I used the equation for 1cm x 1cm die size to extrapolate to other die sizes.