SRM32F411CE Soldering UFQFPN48 0.5mm pitch.

Поділитися
Вставка
  • Опубліковано 28 гру 2024

КОМЕНТАРІ •

  • @1over137
    @1over137  Рік тому +2

    4:20 for the action

  • @DPLS77
    @DPLS77 9 місяців тому

    1:33 couldn't you just have dabbed on some flux on top of the chip, heat it with an air gun, and allow the flux to melt letting the chip easily fall into place because of surface tension?

  • @klazzera
    @klazzera 10 місяців тому

    no flux😢

    • @1over137
      @1over137  9 місяців тому +1

      It's not easy to see, but it was covered in flux. There is a small puddle of it under the board when it's lifted too.
      I use a flux pen, it's like a marker. You "paint" the area in flux.
      I agree though. I probably should have used more.
      The chip did "spring" itself into place eventually.
      I never did test the board though.

    • @klazzera
      @klazzera 9 місяців тому

      @@1over137 ah okay youre flux pen guy. never used one of these and can't really say anything about them.