I used to work in a clean room in US building medical grade electronics(pacemakers, defibrillators), it was FDA regulated, it was spic and span clean, you could look into the air conditioning vents and there was no dust. We used all automatic K&S 5mil wire bonders and 1.5mil gold ball bonders, all the microscopes were brand new Leica’s. In all honesty though, wire bond is an old technology anyhow, most companies use inverted ball bonding now.
Nice video! Is that board design available somewhere? We're expecting a batch of bare dies too and would be great to have a more detailed look at what you did here
That was a funny intro!
😂 So cool again!
I used to work in a clean room in US building medical grade electronics(pacemakers, defibrillators), it was FDA regulated, it was spic and span clean, you could look into the air conditioning vents and there was no dust. We used all automatic K&S 5mil wire bonders and 1.5mil gold ball bonders, all the microscopes were brand new Leica’s. In all honesty though, wire bond is an old technology anyhow, most companies use inverted ball bonding now.
For VLSI maybe; there are still a lot of things which are wire bonded. Sensors, LEDs, lasers...
Ancient ASM bonder, probably from the mid-1990s. To think K&S had machines in the early '80s which could lay 20 bonds per second!
Nice video! Is that board design available somewhere? We're expecting a batch of bare dies too and would be great to have a more detailed look at what you did here
Here you go: github.com/TinyTapeout/breakout-pcb/tree/main/breakout-tt02-cob
@@ZeroToASICcourse great, thanks!
Nice. I wonder what the factory would consider a run size that was profitable or attractive for them? Where are they, Bao'an?
They normally do 10k+
BIGLADS