Chip on Board! Wirebonding ASICs

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  • Опубліковано 29 гру 2024

КОМЕНТАРІ • 10

  • @hicret2905
    @hicret2905 11 днів тому +3

    That was a funny intro!
    😂 So cool again!

  • @martindworak
    @martindworak 11 днів тому +3

    I used to work in a clean room in US building medical grade electronics(pacemakers, defibrillators), it was FDA regulated, it was spic and span clean, you could look into the air conditioning vents and there was no dust. We used all automatic K&S 5mil wire bonders and 1.5mil gold ball bonders, all the microscopes were brand new Leica’s. In all honesty though, wire bond is an old technology anyhow, most companies use inverted ball bonding now.

    • @douro20
      @douro20 10 днів тому

      For VLSI maybe; there are still a lot of things which are wire bonded. Sensors, LEDs, lasers...

  • @douro20
    @douro20 10 днів тому +1

    Ancient ASM bonder, probably from the mid-1990s. To think K&S had machines in the early '80s which could lay 20 bonds per second!

  • @rjordans
    @rjordans 11 днів тому +1

    Nice video! Is that board design available somewhere? We're expecting a batch of bare dies too and would be great to have a more detailed look at what you did here

    • @ZeroToASICcourse
      @ZeroToASICcourse  10 днів тому +2

      Here you go: github.com/TinyTapeout/breakout-pcb/tree/main/breakout-tt02-cob

    • @rjordans
      @rjordans 10 днів тому +1

      @@ZeroToASICcourse great, thanks!

  • @spehropefhany
    @spehropefhany 11 днів тому

    Nice. I wonder what the factory would consider a run size that was profitable or attractive for them? Where are they, Bao'an?

  • @jagbains6845
    @jagbains6845 10 днів тому +1

    BIGLADS