VLSI Methodologies: Introduction to VLSI design, Moore’s Law, VLSI Design flow, Design hierarchy, VLSI Design style: Full custom, Gate array, standard-cell, Macro cell based design, Field programmable devices, design quality. MOSFET: Electrical characteristics of MOSFET, Threshold voltage, Body effect, current expression (gradual channel approximation method), Channel length modulation, MOSFET scaling: constant field and constant voltage scaling, Short-channel effects. Unit process in VLSI and IC fabrication: Unit process in VLSI: Wafer preparation, Oxidation, Diffusion, Ion implantation, Deposition, Metallization, Etching and Lithography. nMOS fabrication, n-well and p-well process . CMOS Logic Circuits: General CMOS logic structure, VTC of inverter, noise margin, Different types of inverter (resistive load, enhancement and depletion nMOS load and CMOS), Switching characteristic (propagation delay and parasitic capacitance estimation), NAND, NOR and other complex CMOS logic circuits, Sizing of CMOS logic circuits, CMOS Power: static and dynamic power dissipation, latch-up, sizing for large capacitive load,. Dynamic CMOS logic circuits, charge leakage and charge sharing problem, dynamic gate cascading problem, Domino and NORA logic, Introduction of sequential CMOS logic circuits, Stick diagram. Layout and Layout design rules. Physical Design Automation: Objectives and goals of partitioning, floor planning and placement, Global routing. THIS IS OUR SYLLABUS
VLSI Methodologies: Introduction to VLSI design, Moore’s Law, VLSI Design flow, Design
hierarchy, VLSI
Design style: Full custom, Gate array, standard-cell, Macro cell based design, Field
programmable devices, design quality.
MOSFET: Electrical characteristics of MOSFET, Threshold voltage, Body effect, current
expression (gradual channel approximation method), Channel length modulation, MOSFET
scaling: constant field and constant voltage scaling, Short-channel effects.
Unit process in VLSI and IC fabrication: Unit process in VLSI: Wafer preparation, Oxidation,
Diffusion, Ion implantation, Deposition, Metallization, Etching and Lithography. nMOS
fabrication, n-well and p-well process .
CMOS Logic Circuits: General CMOS logic structure, VTC of inverter, noise margin, Different
types of inverter (resistive load, enhancement and depletion nMOS load and CMOS), Switching
characteristic (propagation delay and parasitic capacitance estimation), NAND, NOR and other
complex CMOS logic circuits, Sizing of CMOS logic circuits, CMOS Power: static and dynamic
power dissipation, latch-up, sizing for large capacitive load,. Dynamic CMOS logic circuits,
charge leakage and charge sharing problem, dynamic gate cascading problem, Domino and
NORA logic, Introduction of sequential CMOS logic circuits, Stick diagram. Layout and Layout
design rules.
Physical Design Automation: Objectives and goals of partitioning, floor planning and
placement, Global routing.
THIS IS OUR SYLLABUS
please sir provide all syllabus video of vlsi design
makaut syllabus
please sir provide all syllabus video of vlsi design
makaut syllabus
we need sir
bhai saare chapter ki daaldo yrr 19 ko paper hai
MAKAUT 6TH SEM
VLSI
please sir provide all syllabus video of vlsi design
makaut syllabus
Ara bhai ya kis course ka ha......