Challenges and Strategies for high volume manufacturing and testing of Co-Packaged Optics

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  • Опубліковано 27 лют 2023
  • Co-Packaged Optics (CPO) promises significant density, power, and thermal advantages for next gen AI/ML systems and data center switches compared with current transceiver assemblies. But how can CPO systems be assembled in high-volume? What test and measurement approaches will be needed to ensure spec compliant operation.
    In this one-hour webcast we will hear from Torsten Vahrenkamp, CEO and co-founder of ficonTEC GmbH and Kees Propstra, VP of Marketing & GM Quantifi Photonics USA Inc.
  • Наука та технологія

КОМЕНТАРІ • 1

  • @simeonradev7174
    @simeonradev7174 9 місяців тому

    Thank you for sharing this talk 🙂