Silicon Photonics - Co-Packaging Webcast

Alexander Janta-Polczynski, IBM Global Engineering Solutions Microelectronic Package Development Engineer and Vikas Gupta, Director of Product Management & Marketing at GLOBALFOUNDRIES provide an update on Silicon Photonics co-packaging and manufacturing techniques and discuss competitive approaches such as paralleled fiber assembly and the complaint polymer interface method.

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slides （.ppt）available ?

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16:50 Fiber Array

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24:40 Automated fiber ribbon attach