Thank you sir very helpful videos. I have a question to ask, What are the key verification methods used to ensure WBG devices are bonded correctly to their substrate/lead-frame?
Common requirements to check bonding quality at production level are bond shear and wire pull test. You can also check for intermetallic formation. For product / package development you will need to do reliability testing according to industry standards.
Very good explanation. Thank you very much!
Thank you sir very helpful videos. I have a question to ask, What are the key verification methods used to ensure WBG devices are bonded correctly to their substrate/lead-frame?
Common requirements to check bonding quality at production level are bond shear and wire pull test. You can also check for intermetallic formation. For product / package development you will need to do reliability testing according to industry standards.
Good job! Thank you!
Boss LGALE 🔥🔥🔥
256 pin count is the 7th quadrant in my algorithm.
Was there supposed to be sound?
Purposely created the video without an audio.