ASE: Semiconductor Packaging and Testing, the State of the Art

Speech Title: The Future is Heterogeneous Integration
Semiconductor technology is fueling the digital transformation that is increasingly being used to solve some of the world’s greatest challenges. Our connected lives generate 2.5 quintillion bytes of data daily, driving unprecedented demand for bleeding edge digital networks, connectivity, storage, memory, edge to cloud computing, and so much more.
Heterogeneous Integration refers to the integration of separately manufactured components into a higher-level assembly (System-in-Package, known as SiP) that in the aggregate provides enhanced functionality and improved operational characteristics. It is now the key technology direction going forward, driving the pace of advancement for greater intelligence and connectivity, higher bandwidth and performance, and lower latency and power per function, all at a more manageable cost.
During his presentation, Dr. Bill Chen will introduce the heterogeneous integration roadmap, describing how broad ecosystem collaboration is positioning the industry to initiate a new era of technological and scientific advances to continue and complement scaling into the future.