Multifunctional pull tester for wire bonding test MD-BT104 MD-BT101 Pull Tester for wire bonder

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  • Опубліковано 26 сер 2024
  • Application area:
    Semiconductor packaging, TO series packaging, Military components, LED packaging, IGBT packaging, Microelectronic packaging.
    If you want to konw more, contact our engineer:
    【Minder Hu】
    WeChat/Whatsup: 15813334038
    Email:
    minder@minder-hightech.com
    shunyu.hu@163.com
  • Наука та технологія

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