Lecture 30 (CHE 323) Chemical Mechanical Polishing (CMP)

[@axelmeramas976]

you are a life saver, bless you Chris

[@possible-realities]

It's interesting that CMP introduces lots of particles, which you otherwise want to avoid at all costs in wafer processing. I suppose that it's tightly controlled in a way that you can get rid of them afterwards.

[@kylee5621]

thanks. your lectures are really helpful

[@ChrisMack]

PDF copies of all the slides in this course are available at:
www.lithoguru.com/scientist/CHE323/course.html

[@user-ib1mr4xk3p]

thank you for nice teaching =)

[@user-sk6vh2lc8z]

thank you so much.

[@toddtaylor6110]

Rodel....Thanks Bill B......

[@chinoisbase]

HI, do you have any simple article, work or book, regarding CMP parameters (downforce, table-chuck speed, slurry flow) for a standard 4 inchs silicon wafer? Thank you

[@sonal8668]

Could you please explain reflow and etch back little more? Is it still used in the industry?

[@vikrampratapsingh6846]

tq