When I was working on my MSc degree (in Rio de Janeiro Brazil), I heard from a friend of mine ( Cuban ). " how easy it would have been to get my engineering degree if I had Google" When I was watching this video, I wondered.... " how hard it must have been to be a PCB designer before Zachs Peterson on UA-cam"
Too quick summary: Type I is just a hole, Type III is plugged, Type V is filled in. Even numbers mean to cover the hole with soldermask. -B means to do the same thing to the other side (so doesn't apply to V). VII means to add conductive metal back so the full pad is still conductive, despite having removed the copper with the drill. (And there is no _standard_ VIII because adding a conductor but then covering it anyhow is a strange case.)
So what is your "go to" via? I mean what do you mostly use? What vias do you recommend for general use? What via types do you not recommend at all? what should only be used for cheap toys and what is good for using a rough conditions etc. Good explanation in general, but you could have guided us a bit more for when to use what type.
Don't specify anything if you don't need it. Cover it if you have silkscreen Tent it if you are worried solderpaste comes through Plug it for additional protection (I recommend against plugging both sides cause the via can explode due to the trapped air... even tho I heard manufacturers have this under control now) type 7 if you want to do via in pad This is a broad generalization and doesn't cover all cases, you need to think about it.
@@SwitosVideo (1) Is there a difference between "covered" and "tented"? (2) Did I correctly understand your earlier answer as saying that if the via doesn't show up (as a hole) in the soldermask layer, the assumption is that the soldermask will be drilled through, rather than leaving it tented?
@@jimjjewett 1) covered is just soldermask put over the via, tented is an extra protective layer put on top the via 2) most manufacturer will cover it with soldermask without asking and some may ask if its intentional
Why does "cover with soldermask" need to be called out on the vias, instead of just not making a hole in the mask layer? Is it just to avoid ambiguity, or is there something a little different needed in the process when the mask isn't supported? (And does this special requirement/processing apply even to smaller vias?)
You can do it like this and most manufacturer will understand you want IPC Type 1 Before Altium added this feature you did it like this no need to specify... only when you want for example tented you needed to specify In the past before you could define it I even made Type 7 Vias a weird size and specified it in a Readme file... now in Altium you can just select it and it exports additional layers just for this porpuse
When I was working on my MSc degree (in Rio de Janeiro Brazil), I heard from a friend of mine ( Cuban ).
" how easy it would have been to get my engineering degree if I had Google"
When I was watching this video, I wondered.... " how hard it must have been to be a PCB designer before Zachs Peterson on UA-cam"
Too quick summary: Type I is just a hole, Type III is plugged, Type V is filled in. Even numbers mean to cover the hole with soldermask. -B means to do the same thing to the other side (so doesn't apply to V).
VII means to add conductive metal back so the full pad is still conductive, despite having removed the copper with the drill. (And there is no _standard_ VIII because adding a conductor but then covering it anyhow is a strange case.)
So what is your "go to" via? I mean what do you mostly use? What vias do you recommend for general use? What via types do you not recommend at all? what should only be used for cheap toys and what is good for using a rough conditions etc. Good explanation in general, but you could have guided us a bit more for when to use what type.
Don't specify anything if you don't need it.
Cover it if you have silkscreen
Tent it if you are worried solderpaste comes through
Plug it for additional protection (I recommend against plugging both sides cause the via can explode due to the trapped air... even tho I heard manufacturers have this under control now)
type 7 if you want to do via in pad
This is a broad generalization and doesn't cover all cases, you need to think about it.
@@SwitosVideo (1) Is there a difference between "covered" and "tented"? (2) Did I correctly understand your earlier answer as saying that if the via doesn't show up (as a hole) in the soldermask layer, the assumption is that the soldermask will be drilled through, rather than leaving it tented?
@@jimjjewett 1) covered is just soldermask put over the via, tented is an extra protective layer put on top the via 2) most manufacturer will cover it with soldermask without asking and some may ask if its intentional
@@SwitosVideo So is tenting a different material, or just an extra layer?
Why does "cover with soldermask" need to be called out on the vias, instead of just not making a hole in the mask layer? Is it just to avoid ambiguity, or is there something a little different needed in the process when the mask isn't supported? (And does this special requirement/processing apply even to smaller vias?)
You can do it like this and most manufacturer will understand you want IPC Type 1
Before Altium added this feature you did it like this no need to specify... only when you want for example tented you needed to specify
In the past before you could define it I even made Type 7 Vias a weird size and specified it in a Readme file... now in Altium you can just select it and it exports additional layers just for this porpuse