Is it me or isn’t this just basically MIG welding with Aluminum? Love the lecture you have inspired me to build my own alternative manufacturing system. ❤
Dear Prof, Let me know the procedure .. 1. Vacuuming Chamber down to 1.10-6 mBar. In this condition, we hope all air particle has gone ! 2. Enter the argon gas. - How pure is Argon? - How much pressure? 3. Turn on the power supply. - I thought, using DC power. Please correction. - What is the voltage, current used? 4. Is there a formula relating the correlation between: - Different potential, current, operating time and chamber pressure? - or if you have the above correlation based on the rule of thumb, please inform me. 5. Thanks for the explanation. Regards, Pranahadi
Hello, I can help you out with some questions, since I'm studying this subject and did some experiments with UHV 1. Ofc not all air particles are gone (and water particles in the air etc), they are just few so it wouldn't affect the process that much anymore. 2. Usually Argon is kept at 10e-2 to 10e-3 mbar. The purity used in our case was Argon 5.0. Exact partial pressure from Argon was something 5*10e-3 mbar 3.The voltage is of course high to achieve plasma (500-1000V). You use DC althought there is a highfrenquency sputtering that uses AC Current is chosen on the desired thickness of the layer based on constant time. For example for Co-Target for 15 sec, with 0,2A the thickness achieved was 0,3 nm. It depends mostly on Target material, time and the entire device basically. 4.Honestly, neither. You can try with using measurements from other people but it will always be different since the size is different, the geometry of target may be different etc. Too many factors to make one rule or formula. But generally with higher current the thickness increases exponentially (at least it looks like that).
while noble gases are chemically inert, the energy provided by the electric field in a plasma is sufficient to ionize them, enabling their use in the sputtering process. And Argon easily ionised in that applied voltage.
The specific timing of ionization in sputtering can depend on a variety of factors, such as the sputtering conditions (e.g., the gas pressure, the sputtering power, and the target material), as well as the properties of the incoming ions or electrons. In general, however, ionization is an ongoing process that occurs throughout the sputtering process as long as there is sufficient energy available to ionize the gas atoms.
to be constructive, this was actually terrible to watch. "ugh ahh, ughhh" , "duhh ughh" man the whole video was that. yes you know what u are talking about but no excuse. not the age, the awkwardness , that whatever, and anyone who is enabling saying it perfect isn't helping. speak faster, with purpose, and highlight your words purpose, find a young student to help you make good quality videos, its the generation of tiktok. just tell them you need help, to make videos, and they will help you. idk its just sad to see, someone so smart be completely bottlenecked by his ability to make presentations, I understand the gentleman is a boomer, but that doesn't mean his videos have to look like they were made in 1985... a new phone camera could shot better quality from this 480p junk
Is it me or isn’t this just basically MIG welding with Aluminum? Love the lecture you have inspired me to build my own alternative manufacturing system. ❤
Very good demonstration. Thank you.
Excellent lecture. I am so happy i found this.
Thank you for all of the content
in which collage are you in ?
@@sahilrao4592 i finished my schooling a few years ago. Im just building a couple purpose built bench top machines for personal use.
Which process of depositing film is slower? Cathode sputtering or evaporation methode
Sir explain the oxidation of copper to copper oxide please
Hi prof Can we measure anode vs ground with multimeter?
Dear Prof,
Let me know the procedure ..
1. Vacuuming Chamber down to 1.10-6 mBar.
In this condition, we hope all air particle has gone !
2. Enter the argon gas.
- How pure is Argon?
- How much pressure?
3. Turn on the power supply.
- I thought, using DC power. Please correction.
- What is the voltage, current used?
4. Is there a formula relating the correlation between:
- Different potential, current, operating time and chamber pressure?
- or if you have the above correlation based on the rule of thumb, please inform me.
5. Thanks for the explanation.
Regards,
Pranahadi
Hello, I can help you out with some questions, since I'm studying this subject and did some experiments with UHV
1. Ofc not all air particles are gone (and water particles in the air etc), they are just few so it wouldn't affect the process that much anymore.
2. Usually Argon is kept at 10e-2 to 10e-3 mbar. The purity used in our case was Argon 5.0. Exact partial pressure from Argon was something 5*10e-3 mbar
3.The voltage is of course high to achieve plasma (500-1000V). You use DC althought there is a highfrenquency sputtering that uses AC
Current is chosen on the desired thickness of the layer based on constant time. For example for Co-Target for 15 sec, with 0,2A the thickness achieved was 0,3 nm. It depends mostly on Target material, time and the entire device basically.
4.Honestly, neither. You can try with using measurements from other people but it will always be different since the size is different, the geometry of target may be different etc. Too many factors to make one rule or formula. But generally with higher current the thickness increases exponentially (at least it looks like that).
@@poppy1x3 thanks a lot for sharing your knowledge!
Argon is a noble gas so how can it be made into an ion?
while noble gases are chemically inert, the energy provided by the electric field in a plasma is sufficient to ionize them, enabling their use in the sputtering process.
And Argon easily ionised in that applied voltage.
So, Argon easily ionised that applied voltage in the chamber.
what will happen to the released electron after ionization?
Hi sir, I have few questions on sputtering, about sputter deposit on Sin film
At what time ionization of Argon gas will happen?
The specific timing of ionization in sputtering can depend on a variety of factors, such as the sputtering conditions (e.g., the gas pressure, the sputtering power, and the target material), as well as the properties of the incoming ions or electrons. In general, however, ionization is an ongoing process that occurs throughout the sputtering process as long as there is sufficient energy available to ionize the gas atoms.
Thank you.
Can oxides be used to sputtering ?
yes
Just by putting an oxide powder pn target itself or in some mix with conductive elements?
Yes.
Beautiful 🎩😍
Nice
Lines on picture so watch the diagram is too difficult😣
good lecture
Bnsr vs étés bien. Bn la pulvérisation catholique m'intéresse tu peut m'aider !!!
thanks good
to be constructive, this was actually terrible to watch. "ugh ahh, ughhh" , "duhh ughh" man the whole video was that. yes you know what u are talking about but no excuse. not the age, the awkwardness , that whatever, and anyone who is enabling saying it perfect isn't helping. speak faster, with purpose, and highlight your words purpose, find a young student to help you make good quality videos, its the generation of tiktok. just tell them you need help, to make videos, and they will help you.
idk its just sad to see, someone so smart be completely bottlenecked by his ability to make presentations, I understand the gentleman is a boomer, but that doesn't mean his videos have to look like they were made in 1985... a new phone camera could shot better quality from this 480p junk
no offense but this put me to sleep 4 mins in. make it easier to digest, and stay focused pls.
I am pvd opretor