I am too late. Needed this exact chip to fix the time machine and this was the only one according to the historical records. Now John Conner will never be born!!
Anthony Cullison early chips were ceramic and plastic came later. The military still favors ceramic and sometimes ceramic is used for its superior heat dissipation. Also, early chips used gold, on old chips the gold color is not just a gold color, it’s genuine gold.
@@jakp8777 I was assuming it was for thermal characteristics, but that wouldn't make any sense unless all the chips on the board were ceramic, and the board itself was ceramic or of another heat resistant construction
Anthony Cullison it’s thermal properties of the chip, not the board. Some chips use more power and hence dissipate more heat especially in early cause of chip technology. There is such a thing as ceramic PCBs, some high end and older LED lamps mounted the LED on a ceramic PCB because of heat. IGBT transistors, commonly used in motor controllers and welders are typically ceramic with a goo covering the electronics to dissipate the heat.
Modern ones use balls to join the die to the interface section, which then spreads out the very tiny connections to a larger area for the socket to make contact. The balls are making contact between the metal layer on the silicon and the copper on the interface board, so both have a gold plate on them to interface between the aluminium/copper on the silicon die and the copper on the interface. Any large IC that uses a BGA layout also invariably uses this, as if they had lower pin count they would have gone for a much cheaper leadframe plastic package and bond wires. Interface board is a very expensive part, as it has multiple layers and multiple blind vias in it as well, often smaller than a hair in diameter. Often more expensive than the silicon die that is bonded to it. Only smaller chips use bond wires, like those that have QFP leads, as otherwise there is no room to get all the bond wires out, and you cannot have multiple layers of bonding wires in a plastic package, though you can with a ceramic package, as in the ceramic you can fill the internal space after bonding with Parylene, which holds the longer wires in a compliant gel that prevents vibration.
Love these videos! Do you do this type of work professionally or did you gather this knowledge as a hobby?
very informative !!! the sound is muffled thought but i love these types of videos
Thank you-always look out for you videos !
Unintentional ASMR...
I am too late. Needed this exact chip to fix the time machine and this was the only one according to the historical records. Now John Conner will never be born!!
Super 👍
Why use a ceramic package?
Anthony Cullison now, because of heat dissipation typically. Then, because that’s what they had at the time.
@@jakp8777 really?! I thought epoxy packages have been around as long as ICs have been
Anthony Cullison early chips were ceramic and plastic came later. The military still favors ceramic and sometimes ceramic is used for its superior heat dissipation. Also, early chips used gold, on old chips the gold color is not just a gold color, it’s genuine gold.
@@jakp8777 I was assuming it was for thermal characteristics, but that wouldn't make any sense unless all the chips on the board were ceramic, and the board itself was ceramic or of another heat resistant construction
Anthony Cullison it’s thermal properties of the chip, not the board. Some chips use more power and hence dissipate more heat especially in early cause of chip technology. There is such a thing as ceramic PCBs, some high end and older LED lamps mounted the LED on a ceramic PCB because of heat. IGBT transistors, commonly used in motor controllers and welders are typically ceramic with a goo covering the electronics to dissipate the heat.
datasheet is here: www.datasheets360.com/pdf/4141327761124288061
Excellent! Thanks for finding that
Never occurred to me, but does a modern cpu have more than a thousand bond wire? As many pads it has.
Modern ones use balls to join the die to the interface section, which then spreads out the very tiny connections to a larger area for the socket to make contact. The balls are making contact between the metal layer on the silicon and the copper on the interface board, so both have a gold plate on them to interface between the aluminium/copper on the silicon die and the copper on the interface. Any large IC that uses a BGA layout also invariably uses this, as if they had lower pin count they would have gone for a much cheaper leadframe plastic package and bond wires. Interface board is a very expensive part, as it has multiple layers and multiple blind vias in it as well, often smaller than a hair in diameter. Often more expensive than the silicon die that is bonded to it.
Only smaller chips use bond wires, like those that have QFP leads, as otherwise there is no room to get all the bond wires out, and you cannot have multiple layers of bonding wires in a plastic package, though you can with a ceramic package, as in the ceramic you can fill the internal space after bonding with Parylene, which holds the longer wires in a compliant gel that prevents vibration.
10:00?
System Internals ZoomIt