Niobium Phosphide - The Future of Ultrathin Electronics?

#niobiumphosphide #nanoelectronics #thinfilm
A Stanford University study reveals that ultrathin films of niobium phosphide, a topological semimetal, exhibit superior electrical conductivity compared to copper at nanoscales. This surpasses copper's performance in circuits smaller than 5 nanometers, even at room temperature. The material's unique surface properties contribute to this enhanced conductivity, and its amorphous structure simplifies manufacturing for integration into existing silicon-based chip technology. This breakthrough could significantly improve the energy efficiency of electronic devices, particularly data centers. Further research aims to optimize niobium phosphide for practical applications and explore other materials with similar potential.
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