PACE Rework and Repair "Component Removal"
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- Опубліковано 12 лис 2011
- PACE Rework and Repair For Electronics Lesson 3
2012 Pace soldering stations,system and self contained vacuum desoldering stations,systems and repair stations! See them on our new web site, soldering station page,
www.paceworldwide.com/products...
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"Get in and out as fast as you can."
Good advice for many things in life.
hahahaha
That's Paul Anthony, aka the "Weather Man". He was DC's most recognized weather man at the time these videos were made.
I feel like I've heard his voice at an airport as well.
10:27 perfect explanation for capillary action
I know these videos are 30 + years old. But, I was wondering if you still offer the training materials.
I totally agree with paceworldwide/Mr. Siegel with the above quote. From my 21 years experience with Class II and III boards under IPC-A-610 standards, the all of the techniques on paceworldwide's channel is the minimum standard that was and is imperative to soldering. As a matter of fact, Class III can require much more meticulous work with next to no error and no second chances or deviations from the proper industry specified standard.
Thank you Gilvin. you may also want to see repair process documents on the Pace Inc. site. Look in the index under process guides. Also I saw your channel and see your an Eva Cassidy fan. I play jazz with her Father here in Maryland. Check out my tool box demo of Pace hand-pieces by searching "Every thing you wanted to know about soldering and desoldering but were afraid to ask". This older presentation testifies that Pace Inc. was the first to develop specialized tools and processes for PCB's
It's really weird when you see an over 30 years old video from accross the pond no less and it has almost exactly the same solder sucker in it, that I have on the bench. Not that mine is 30 years old, I just bought it a few month ago for less than 2€. Except for a small part of the handle, where it's got a company name, it's the same. The same blue cylinder, the same yellow button and cap on the end, the same tip. And there I thought it was a recent cheap chinese mass product (which works surprisingly well, compared to many other, often much more expensive, solder suckers I had).
Btw. love the videos. Looks like they were made at the right time. A little bit sooner and ICs and multilayer boards may would have been so niche that noone would make a video for. But so the content is still relevant today.
I use the Pace - MBT250-SDTP, A little more advanced.
yep when china have ripped off the design, same goes for the cheap flush nippers, ripped off an old plato design, some cheap chinese soldering irons are also copied from weller 1960's, which they dont make anymore, there are dozens of other examples!
I was very impressed with how this remained incredibly relevant despite the rapid acceleration in sophistication technology constantly exhibits
Btw. I'm still using the exact same solder sucker. And I don't mean the same model, I'm talking about the same thing. I went at the tip once or twice with a knife to clean it up, but it still works. Can't beat that for 2€. Now what do I do with the 3 additional ones I bought? XD I got them immediately after I used the first one for a short time, because it worked so well. I wanted to have some spares just in case I couldn't get them later anymore. That was before I knew they've been around for at least 30 years at the time, and before I knew that a single one would work for many years. And also they are still available to buy.
Soldapullt!!
Now we use SMT and multi-layer boards, but the technics are always the same, and this is a great great tutorial.
I learned them from tons of trail and errors, hope anyone who wants to learn electronics repairing watch these first.
nice vids!
Thank you so much. We hope this film will improve your operations. Very Best Marc
that groovy drum beat at the start is good..coppyright 1982
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that intro beat was pure fire.
fire = good in street talk .
now go join a gang and tell them about WPI.
😐
That jam at the begging.
I have recently been using a PS90 desoldering gun and thought bit perhaps a bit lacking. However this is a great video and I perhaps need to rethink how I have been using it. Many thanks.
Interesting thought. Modern day boards? I would not count that boards are made better. Cost's are a big factor as well as the class level of the board. Advanced electronics such as avionics fire controls etc. 80 percent of Bond is lost when solder is fully melted and recovers during cooling. Get in and out ASAP with no pressure. Always be careful. Thanks for watching. My very best, Marc W. Siegel
These videos are gems. Are there any of the workbooks still available?
Excellent marketing material, off to buy some PACE equipment to enhance my JBC equipment.
Sir excellent stuff I like very much and I'm very interested in learning like this skills thank-you very much sir
My man, talking facts !
Fantastic
love these professional training videos there's another good one from the RCAF on antennas too. not as exciting as this as it's from 50s or 60s
PACE, thanks!
this videos are amazing
its old but good
thanks pace
Thanks!
you need to fix the audio sync problem on here and reupload it
I have a question!
What is the proper process to remove a lead that's bent?
Thanks !
I really like that intro music. Any chance there is a full version somewhere?
Movement (1) by Barry Morgan and Herbie Flowers
Whack dem bongos, YES MAN!!
James Solder Bond 😎
too much heat will destroy the joint, theres a lesson for life guys
No more than 2-3secs !
Wow, DeeLite probably got inspo from this intro...
Yeah solder extraction
I noticed a great amount of concern for dwell time for soldering/unsoldering in these videos. Since these days the construction of circuit boards has probably improved greatly over 1980s design, you'd think that this problem would have been reduced - so modern circuit boards can probably tolerate more heat for longer and there's less risk of damaging/losing pads.
Am I correct in saying this?
Forgive the necropost here, but in my experience, the boards themselves haven't really improved (if anything, they're made worse than they used to be), but components themselves have become less sensitive to heat. For instance, if I were replacing an IC in an 8 bit computer, I would be really cautious about dwell time when I install the new chip. I might even socket it just to eliminate the possibility of ruining the replacement part. But on a new part on a new board? I would worry more about ruining a pad than an IC. I've even seen some people remove ICs by globbing a ton of solder on all legs, creating a massive bridge, and then wicking the solder away or heating the chip with a hot air rework gun. And then the chip is actually fine at the end of it. I can't imagine that being a good idea on 1980's ICs.
Yep, you're absolutely right. Nowadays a LOT of components are actually incredibly resistant to heat, even the most common 0402/1005 packages. Semiconductors are still prone to heat damage but it greatly depends on the makeup of the package. ICs and (most) BGAs actually contain a lot of heatsinking as the actual chip die resides under a thick layer of epoxy resin, making hot air removal a non-problem unless you're really dumb or still practicing with how best to use it.
However, something like a CPU is where you want to keep heat to a minimum. Sure, it has all the benefits of a thick epoxy resin, but it also contains billions of semiconductors and all it takes is for one of them to fail or become dislodged to keep it from functioning.
Board makeup has not changed much over the last 20 years. You still have the common ceramic, mylar, and epoxy glass makeups. What has changed however is the use of coatings and resins. Most boards which contain BGA flip chips utilize underfill, which is basically a resin that fills an excavated basin beneath the chip and flows around the ball array. The purpose of this is to keep the balls from oxidizing and it also maintains a secure mechanical connection with the chip. The downside is it's a pain to deal with.
All underfills are different and Apple likes to use a type that actually hardens into the equivalent of concrete when it passes a very small temperature window where it's soft enough to pull the chip without damaging a pad. Samsung on the other hand has a very easy kind to deal with, where this hardening state doesn't happen. However all underfills universally contract as they are being heated. This can cause components in the underfill to literally pop out of their solder joints.
Nowadays there's a lot less emphasis on the necessities of absolute control over heat, at least in the realm of consumer electronics repair. However the rules still apply. Back in the 80's you'd run the risk of destroying a transistor and damaging its pad if you used too much heat. Nowadays that same amount of heat will definitely get that transistor off and it will still be fine, but the pad most definitely will not be. Especially in regards to wicking, which is something to always be mindful of when it comes to heat.
In my own experience I've never damaged pads from simply removing a component. However, it's guaranteed I'll pull a pad if I use too much heat when wicking.
@@ZiggyTheHamster But will the IC still work at long-term? (I'm new to soldering) They've said in other videos that stuff may work for a day or week or a month, but may fail after that, if it was heated up too much. Unless these things are actually resistant to near this amount of heat and then it's fine if it's not that long.
@@Edw590 the way that the smaller processes work nowadays, it isn't really possible to sink enough heat to degrade it but not enough to kill it. If you heat it too long/hard, it just dies. The crossover point is very small, compared to vintage ICs where you can easily damage a gate without immediately killing the IC.
There are some exceptions to this. Some Intel Atom CPUs have gates that degrade due to heat, but that's in-die heat and prolonged. vs. soldering which would be over rather quickly
What is the name of the instructor
Intro song is Movement (1) by Barry Morgan and Herbie Flowers, thank me later ua-cam.com/video/xvoIKc-5uRk/v-deo.html
Hi,
There only one problem in removing components. Its called ROHS.
ROHS only applies when you throw away components, not when you simply remove them.
and you can still use lead solder to repair items, rohs doesnt affect that