Not Just Chips: Retrospective on MEMS packaging - challenges to be considered / chalenges to be...

Retrospective on MEMS packaging - challenges to be considered / chalenges to be solved (market needs)
Doug Sparks
The evolution of MEMS packaging will be covered, spanning early pressure sensors in the 1960's that used metal TO cans & custom industrial sensors to plastic automotive packaging starting in the 1980s -1990s with pressure, flow, acceleration sensors and gyroscopes. The talk will then dive into the medical and consumer space, from blood pressure and biocompatible implants to smartphones, gaming and wearable devices. Wafer level packaging and associated MEMS chips scale packaging (CSP) will be summarized with regard to hermetic bonding and CVD sealing technology. Lastly the advent of 3D printing or additive manufacturing and how this is impacting the assembly, prototyping and packaging of sensors made of plastic, glass and metals.