Quick 861Pro Smart Hot Air BGA SMD Desoldering Station with Voice Control

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  • Опубліковано 17 лип 2024
  • The Quick 861Pro is a high-performance hot air desoldering station designed for electronics repair and rework. Key features and specifications include:
    - **Power**: 1300W high power output for rapid heating.
    - **Temperature Control**: Intelligent PID linear temperature control ensures stable and precise temperature adjustments, ranging from 100°C to 500°C.
    - **Airflow**: Uses a brushless vortex fan with an airflow rate of 70 liters per minute, providing low noise and extended life.
    - **User Interface**: Equipped with a full-view HD color screen that dynamically displays temperature settings.
    - **AI Integration**: Includes AI voice control, allowing for hands-free operation.
    - **Ergonomics**: The handle is designed for comfortable use, and the device features cooling hibernation to protect the hot air handle and extend the heating core, life span.
    This station is suitable for a variety of tasks, from desoldering components on circuit boards to other detailed electronics work.
    Surface Mount Device (SMD) technology offers precise control over the installation and removal of components such as CPUs and ICs. One of the key features is the ability to divide a single channel, such as CH1, into three critical aspects: heat, air flow, and timing. This division ensures the following:
    1. Heat Control: By precisely managing the amount of heat applied, SMD technology prevents overheating and ensures that each component, including the CPU and other ICs, is subjected to safe temperature levels. This reduces the risk of thermal damage.
    2. Air Flow Management: Controlled air flow helps in evenly distributing heat and cooling components effectively. This prevents hotspots and ensures that all parts of the PCB are kept within safe operating temperatures.
    3. Timing Precision: Accurate timing control ensures that heat and air flow are applied for the correct duration. This precision helps in maintaining the integrity of the components and the PCB, preventing issues such as solder joint failures or component misalignment.
    By integrating these three aspects into a single channel, SMD technology ensures that the components are installed or removed without causing any damage to the CPUs, ICs, or the PCB itself. This meticulous control mechanism is what makes SMD technology reliable and efficient for delicate electronic assemblies.

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