Self-Heating and Reliability Issues in FinFETS and 3D ICs || Power Dissipation and Thermal Analysis

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  • Опубліковано 8 вер 2024

КОМЕНТАРІ • 11

  • @rizwanshoukat3657
    @rizwanshoukat3657 4 роки тому +3

    Great video Dr. Sb .

  • @ZainabKhan-qj9op
    @ZainabKhan-qj9op 4 роки тому +3

    GREAT LECTURE

  • @creativelaboratoryofengine2538
    @creativelaboratoryofengine2538 4 роки тому +2

    Great work...

  • @rizwanshoukat3657
    @rizwanshoukat3657 4 роки тому +1

    Good work

  • @anaghyati8110
    @anaghyati8110 3 роки тому +1

    very smooth explanation

  • @JunaidKhan-ph1mw
    @JunaidKhan-ph1mw 4 роки тому

    Great lecture

  • @sonaliroybarman7431
    @sonaliroybarman7431 3 роки тому +2

    Why local hot spot is created near the drain region?

    • @engineerimran1
      @engineerimran1  3 роки тому +4

      Drain and Fin bottom region surrounded by lower thermal conductivity region has lower heat flux. This means that the big amount of heat remains in that region. Or you can also think that the heat generated by joule heating is largest in lightly doped drain. Major part of the heat generated here flows to the regions having larger thermal conductivity.

    • @padapada503
      @padapada503 8 місяців тому

      @@engineerimran1Hi professor, aren’t source and drain the same in layout? Or sources are more heavily doped than drains?

  • @charlesr.1920
    @charlesr.1920 2 роки тому

    When you see Self heating impacts in FinFET 16 nm at the SEM level are the failures typically on the top of the fins or contact areas or further down the base of the fins?