[Eng Sub] PoP(Package on Package): Qualcomm, Apple, Samsung - MCeP, InFO, iPoP

[@kunamsbinallamode2409]

I wonder if this differences in packaging that make qualcomm soc more prone to error like in poco x3 pro,m3,asus rog5&6.

[@yisehakg5039]

Very informative and clear and even uptodate information. Thank you so much,

[@semicontalk3223]

Thanks for watching!

[@Parksheena123-vo9ls]

There is another package in which RAM BGA200 is used. In this, all three RAM ROM processors are installed separately on the motherboard. Is this the fast??????? 😅

[@semicontalk3223]

I don't know about this so can't answer for your question.

[@ethanlifethai]

Thnaks fpr good information

[@sadhana2187]

Hi Sir, Could you please give one talk on chiplets vs PoP packaging.

[@semicontalk3223]

Thanks for comment. Sure, I already made a video about PoP so I will make one about chiplet.

[@sadhana2187]

@@semicontalk3223, Thanks a lot for your reply sir.

[@Xiashangguan99]

Pop has better performance then other phone soc's??????

[@semicontalk3223]

PoP(Package on Package) is a vertical package stack structure and bottom package has SoC die, typically application processor and top package has LPDDR memory dies. So it is not correct to compare PoP with SoC.

[@Xiashangguan99]

@@semicontalk3223 sir i mean pop cpu phones are faster than soc powered phones??

[@semicontalk3223]

Yes. Usually PoP is used for high-end smartphone and application processor in bottom package of PoP is the highest performance model. So smartphones using PoP are faster than other smartphone with these reasons.