GA-H61M-DS2 1155 CPU socket first time test removal, with a help of hot plate and hot air gun. BGA

I would call it a sucess. Parameters: hot plate temp. start 115 degC, removal at 163 degC, hot air temp 360 degC no short cuts so you can observe rather crude and lengthy film.
Another film with this mainboard - CPU socket pins unbending: • GA-H61M-DS2 motherboa...
Some edit: this kind of socket needs no balls the junctins are done by the means of solder paste and a stencil or template positioned on the board.