That's not "MAPP" (methylacetylene-propadiene propane) gas. That's "MAP/Pro" which is actually propylene gas. MAPP gas has not been sold in the US since 2008.
just using a side cutter inthe cut between the two halves of the case will have the same effect. but without that you need gas, heat and with a smaller chance to damage the die...
Awesome video Robert. Some of the chips that I'm sending you are ceramic so its nice to know you can get these apart too. I'll get them shipped out to you tomorrow.
I tried decapping chips with a blowtorch, and I got success... but on many chips there's definitely heat damage visible. Don't know what it it, silicium should be fine, maybe metal/glass? The chips I tried it on required nuking of the entire package until glowing orange hot.
Thanks for the vid! :D As someone interested in hardware I'm glad you made this video, but as a machinist it hurts to see you use a toolmakers vice that way! :p
Well, it's on hiatus while I work on project5474.org. When I'm ready to take a break on that, I'll come back to the FPGA. Sorry it's not the answer you were hoping for :/
You're referring to the packaging right? I ask because I am interested in taking some defunct chips (and old super cheap CPUs) and decapsulating them so I can see the die and perhaps even look at one in a microscope. I saw in a video you could decap certain chips by heating them up and then rapidly cooling them, to loosen up the (epoxy?) material.
I haven't used that technique. I'm suspicious of it -- it just seems to me that there is a high probability of damaging the die. But again, I haven't tried it so I can't say for sure.
That's not "MAPP" (methylacetylene-propadiene propane) gas. That's "MAP/Pro" which is actually propylene gas. MAPP gas has not been sold in the US since 2008.
Oooops. My bad. I'll make a note of it in the video.
was going to say the SAME thing! good catch.
Great, yet another thing I learned in this video!
"It's ceramic because you can click your finger on it and it sounds ceramic". Palmface.
I know, right? :/
Its true
@@RobertBaruch better :)
just using a side cutter inthe cut between the two halves of the case will have the same effect. but without that you need gas, heat and with a smaller chance to damage the die...
Awesome video Robert. Some of the chips that I'm sending you are ceramic so its nice to know you can get these apart too. I'll get them shipped out to you tomorrow.
John Scherer oh nice. I even reuse the lids as carriers for dies from plastic packages ☺
So what are the bond wires made from ?
Gold, usually
I tried decapping chips with a blowtorch, and I got success... but on many chips there's definitely heat damage visible. Don't know what it it, silicium should be fine, maybe metal/glass? The chips I tried it on required nuking of the entire package until glowing orange hot.
Thanks for the vid! :D
As someone interested in hardware I'm glad you made this video, but as a machinist it hurts to see you use a toolmakers vice that way! :p
Seems like the chip is glued to the ceramic packaging, how do you get it out?
Can it be decapsulised then encapsulised and have it still work
Not without careful work. It can be done, just not by me :)
When will the CPU on an FPGA series resume? I have really enjoyed that.
Well, it's on hiatus while I work on project5474.org. When I'm ready to take a break on that, I'll come back to the FPGA. Sorry it's not the answer you were hoping for :/
Super cool!
Nice video!! But it would have been nice to see close up the die itself ...
Ah, then you should check out my site: project5474.org. Lots of high-resolution die photos.
@@RobertBaruch How did you get into doing this? Sorry if it's been answered in another video, this is my 2nd video I've checked out on your channel.
Can you do this for ICs in general?
No, just for ceramic ones. Plastic IC's take a lot more work. Check out my video on that: ua-cam.com/video/07b6ba5DBtI/v-deo.html
You're referring to the packaging right?
I ask because I am interested in taking some defunct chips (and old super cheap CPUs) and decapsulating them so I can see the die and perhaps even look at one in a microscope. I saw in a video you could decap certain chips by heating them up and then rapidly cooling them, to loosen up the (epoxy?) material.
I haven't used that technique. I'm suspicious of it -- it just seems to me that there is a high probability of damaging the die. But again, I haven't tried it so I can't say for sure.
I’m pretty sure I have a few of these in a plastic package
Cool.
Begins at 03:21