Thermal Challenges In Advanced Packaging

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  • Опубліковано 15 жов 2024

КОМЕНТАРІ • 4

  • @andymackie2896
    @andymackie2896 2 роки тому +1

    Great overview. DRAM refresh time [f(T)] is the limiting factor for memory on logic. Per discussions at ECTC, photonics will be integrated as the "pentahouse level" in advanced packages, and that will require temperature stability, not just overtemp control. Whether liquid phase cooling of the naked (TIM-free) package will be enough to provide a complete thermal solution remains to be seen.

  • @Brosales1414
    @Brosales1414 3 роки тому +2

    Nice! I'm a mechanical engineering student who really wants to get into this!

  • @wertin200
    @wertin200 4 роки тому +1

    Nice video, great work

  • @ManojKumar-jw5ys
    @ManojKumar-jw5ys 3 роки тому +1

    Thank you sir!!