UCIe™ (Universal Chiplet Interconnect Express™)

Building an open ecosystem of chiplets for on-package innovations
Presented by Debendra Das Sharma (Nereus Worldwide)
High-performance workloads demand on-package integration of heterogeneous processing units, on-package memory, and communication infrastructure to meet the demands of the emerging compute landscape. AI, ML, data analytics, 5G, automotive, and high-performance computing are driving these demands to meet the needs of cloud computing, intelligent edge, and client computing infrastructure. On-package interconnects are a critical component to deliver power-efficient performance with the right feature set in this evolving landscape.
The UCIe 1.0 specification provides a complete standardized die-to-die interconnect with physical layer, protocol stack, software model, and compliance testing. The specification leverages the established PCI Express® (PCI-SIG®) and Compute Express Link™ (CXL™) industry standards.

[@Cycableach]

Thank you Dr. Debendra for this insigthful presentation.

[@sidstar593]

where to get the UCIe 1.0 specification??