How to choose a MOSFET package

When selecting a MOSFET package, we should understand that MOSFET packages can usually be roughly divided into hermetic (such as metal, ceramic, low melting point glass, etc.) and molded type. Choose either the molded or hermetically sealed type. Typically, the purpose of the device, the use of the environment, reliability requirements and cost requirements and other factors.
Since the reliability of MOSFETs, which are molded semiconductor devices, has been significantly improved, their applications are expanding, and they have recently begun to be used in fields with more stringent usage environments, such as automobiles (including engine control sections), measurement control, electronic switches, and large electronic computer bodies. In fact, market data shows that when the devices are installed indoors in a favorable environment, their reliability is the same as that of hermetically sealed semiconductor devices.
In recent years, with the miniaturization of electronic equipment, there has been a growing demand for smaller, thinner packages for MOSFET semiconductor devices. To meet this demand, MOSFET manufacturers have been working to develop devices that can be used in the same way as capacitors, resistors, and other chip products for surface mounting.
Surface-mounted package MOSFETs have the following advantages over pin-inserted packages:
(1) Small size, which can reduce the installation area.
(2) Thin thickness, which reduces the mounting height.
(3) Higher board layout density because no board through-hole is required.
(4) Circuit boards can be installed on both sides.