Vias Blind, Buried, and Beyond

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  • Опубліковано 17 сер 2019
  • The Z direction on a PCB multi-layer is remarkably restrictive. We simply do not draw copper from one layer to the next. We must make use of a copper structure called the via. Over time, to accommodate small components and densely populated boards, more via options have been made available.
    In this video, we will discuss:
    • Sanity check - Make sure that the desired via type works with the stack up
    • Annular rings - the equation to ensure the right fit / hit
    • Explore non-traditional vias types - microvias, back drilled vias, vias-in-pad
    • Documentation - what automatically gets generated and what needs to be provided as a fabrication note
    Would you like to see other webinar recordings or videos from us? Check out ninedotconnects.com/knowledge or reach out to us at info@ninedotconnects.com or 214-699-7719. Thanks!
  • Наука та технологія

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