Microscopic Marvels: You never guess who they are!
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- Опубліковано 16 жов 2024
- Meet the microscopic heroes of advanced tech: Microbumps. These tiny solder bumps connect semiconductor chips, enabling higher performance through precise connections. Microbumps improve electrical performance, reliability, and space efficiency, paving the way for next-gen technologies like AI and IoT. Small components with a massive impact!
#futureofai #advantest #advantesttalkssemi - Наука та технологія