Microscopic Marvels: You never guess who they are!

Поділитися
Вставка
  • Опубліковано 16 жов 2024
  • Meet the microscopic heroes of advanced tech: Microbumps. These tiny solder bumps connect semiconductor chips, enabling higher performance through precise connections. Microbumps improve electrical performance, reliability, and space efficiency, paving the way for next-gen technologies like AI and IoT. Small components with a massive impact!
    #futureofai #advantest #advantesttalkssemi
  • Наука та технологія

КОМЕНТАРІ •