Riding the Second Wave of SiC: Power Packaging

The semiconductor industry is experiencing the next wave of Silicon Carbide (SiC) performance enabling SiC die to perform at higher levels. In the first wave, SiC die was packaged in standard Silicon-based (Si) packaging not designed for fast switching devices like SiC. In this session, we will provide an overview of the advancements in SiC power packaging and demonstrate a performance comparison of an advanced package versus a standard package.