According to Roman, his Thermal Grizzly liquid metal should never be applied to bare copper. R U using something different.?? Also ..... Shouldn't Intel be fixing their chips instead of the other way around.??? I mean I love a good challenge also but we loose the warranty. But I don't think Intel would ever step up and do a recall on these chips anyway.
Hey! Thanks for commenting. We posted a very detailed reply in our latest video regarding this, but here is a summary: 1) Bare copper with gallium (liquid metal): Copper reacts and alloys with Gallium, creating a really thin layer or stain, but this is NOT corrosion and the thermal effect is minimal due to the negligible thickness of such layer. 2) Here is some more detail by Steve from Gamers Nexus, who did an amazing job testing both of these cases, and in his words and own conclusions: “Gallium has a negative potential and copper has a positive potential, which will cause the gallium to migrate and plate the copper. In terms of performance, the copper RETAINS all of its original performance characteristics (in our testing), and so looks a lot worse than it is in reality. This is a stain, NOT heavy pitting or corrosion.” Around min 13:00 on his YT video: ua-cam.com/video/cQaqUyKVIEE/v-deo.html Regarding your other point, definitely agree. Intel should thoroughly think this through prior to launch. Unfortunately we work with what we have, but would love to see some bare die chips (no IHS) directly from the source and let enthusiasts do the rest. Again, appreciate the comment and let us know if you have further questions.
Very interesting!
According to Roman, his Thermal Grizzly liquid metal should never be applied to bare copper. R U using something different.??
Also ..... Shouldn't Intel be fixing their chips instead of the other way around.??? I mean I love a good challenge also but we loose the warranty. But I don't think Intel would ever step up and do a recall on these chips anyway.
Hey!
Thanks for commenting. We posted a very detailed reply in our latest video regarding this, but here is a summary:
1) Bare copper with gallium (liquid metal): Copper reacts and alloys with Gallium, creating a really thin layer or stain, but this is NOT corrosion and the thermal effect is minimal due to the negligible thickness of such layer.
2) Here is some more detail by Steve from Gamers Nexus, who did an amazing job testing both of these cases, and in his words and own conclusions: “Gallium has a negative potential and copper has a positive potential, which will cause the gallium to migrate and plate the copper. In terms of performance, the copper RETAINS all of its original performance characteristics (in our testing), and so looks a lot worse than it is in reality. This is a stain, NOT heavy pitting or corrosion.” Around min 13:00 on his YT video:
ua-cam.com/video/cQaqUyKVIEE/v-deo.html
Regarding your other point, definitely agree. Intel should thoroughly think this through prior to launch. Unfortunately we work with what we have, but would love to see some bare die chips (no IHS) directly from the source and let enthusiasts do the rest.
Again, appreciate the comment and let us know if you have further questions.