Packaging Part 16 3 - Integrated Silicon Photonics

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  • Опубліковано 7 лют 2025

КОМЕНТАРІ • 10

  • @practicalmicrofabrication1858
    @practicalmicrofabrication1858 Рік тому +2

    Very nice! Thanks for sharing

  • @markcatoe1206
    @markcatoe1206 2 роки тому +5

    Hurddle is Over come - Lightwave Logic - makes CPU/ASICs faster, it's all in the EO polymer
    1) Semiconductor modulators are a SUNSET business
    2) LWLG Polymer modulators are a SUNRISE business
    3) LWLG modulators are already more than 3x the speed
    4) LWLG modulators are Order of Magnitude Lower Power
    5) Many Customers & Partners all under NDA currently
    6) Many Foundries implementing LWLG technology in PDK's
    7) at OFC 2022 "gloves were off" and the Customer Base was opening discussing the imminent need for LWLG technology where in previous years such discussions were only behind closed doors under NDA
    8) At OFC 2022 -- Lebby said "so now it is not a case of Lightwave Logic pushing its Polmer technology, it's a case of Lightwave Logic be dragged along by the Customer base saying >> hey this is really cool, we need to utilize this technology!!"
    9) LWLG Polymers are in fact just as Reliable/Robust as Semiconductors

  •  2 роки тому +1

    Great series, thanks Alonso. Hope you add a chapter for LCD chip tech like COB, COG and COF.

  • @ronaldd4012
    @ronaldd4012 Рік тому +2

    One day we'll catch up with Startrek!

  • @GivenFactNotFiction
    @GivenFactNotFiction Рік тому +1

    how much lower energy demand? %?

  • @jatigre1
    @jatigre1 10 місяців тому

    I can't wait for engineers to start writing software in a form that can be read by these systems, so we'll finally have software and hardware unified.

  • @linzhou4248
    @linzhou4248 2 роки тому

    Thanks

  • @movocode
    @movocode 2 роки тому

    can i get ppt link

  • @mustaphaben2921
    @mustaphaben2921 2 роки тому +1

    We may see optical chips in 2030?