QIANLI IATLAS 24K EXPLOSION PROOF GOLD-PLATED FOIL FOR PHONE MIDDLE FRAME SOLDERING

Qianli iAtlas 24K Gold-Plated Foil for Motherboard Soldering
Feature
The 24K gold-plated foil is needed for solder explosion when reballing, tin adhesion, avoid pressing due to crooked motherboard. Improve working efficiency for master lower skill dependency for the green bird.
Highlights
● 24K gold-plated process
● Better anti-oxidation and conductivity
● Achieve a more stable solder explosion-proof
Feature
Support middle frame, chips, and BGA
Clamp the foil as easy as falling off a log
The backbone of the precise electronics hardware
Small size and great efficiency, solder explosion-proof
Applied to all electronic components required lamination
More stable alignment, motherboard slight deformation worry-free
3 kinds of sizes meet various needs with different thicknesses and weights
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