Also bought on an auction 4 boxes of zener diodes. 40k zener diodes, half 12V and the other half 24V 400 mW type. So I have been using them as regular diodes where the voltage is low enough, and I only need 50mA of current rating. They are great on relay coils, use 2 in series, back to back, 12V on a 5V relay, and 24V on a 12V relay coil. Faster release time, just have to make sure the transistor driving the relay is rated over 60V Vceo, or take a gamble that a 30V rated transistor actually will only break down at over 40V in most cases, which is generally true with modern devices. Forward bias them at 2A and they turn into light emitting diodes, after a half second or so, at least till the glass case melts. Got a whole string of them, forward biased, as the voltage regulator on some 2F supercapacitors, 4 in series across each 2F capacitor, to replace an old NiCd battery backup pack, so that you get a good enough emulation of the cells, as they are trickle charged. Self discharge of the capacitors is not a worry, as the battery is there for backing up a clock memory, and thus it will work for at least a day of no power. I got tired of replacing the NiCd cells every few years.
I've got a lot of AVX capacitors too. You hang around eBay long enough you stumble across killer deals. I have more HP SMD LED's than I'll ever be able to use in my lifetime, but for 20 bucks for partial reels it was impossible to pass up.
I had no idea that the SMT diode tabs were flattened copper wire soldered to the die. I envisioned wire bonds in there as dinner other silicon devices packages use.
@@IMSAIGuy The white goop is a low melting point glass, used to seal in the silicon junction and fuse it to the leads. During manufacture they assemble the diode and place it between the ends of the lead frame, with a thin coat of solder paste on the formed ends. Then the glass is applied as a drop of slurry that covers the silicon and the ends, and dried. Then the whole lot is heated up in a inert atmosphere oven to both melt the solder paste to make the connection to the die, and melt the glass to seal the junction in and hold the die under compression as the glass cools. Then the epoxy overmould is applied. You get larger diodes where the glass is applied more thickly, and creates a bead around the diode, so after firing the glass holds it together, and there is no need for a epoxy case. Other manufacturers use instead of glass a white thermoset epoxy, which is heat cured during the soldering time, to do the same protection, as the black epoxy is not a totally hermetic seal, and it does allow water to diffuse through it. That is why your IC packages have the drying sachet in the original packaging, and also why you have to have a specific heating cycle in an oven to bake them if they have been left open, as otherwise the moisture in the package will turn into steam, blowing the epoxy apart. Called popcorning, as it is the exact same process, which destroys the IC.
the 8051 is not microprocessor but is a microcontroller (the first one). So access to the (very limited) rom and ram is difficult. The internal ROM is not programmable and the part had to be ordered. the 8031 had external rom if i remember right. The PIC and ATMEL parts took over microcontrollers having programmable parts
@@IMSAIGuy I'm working on 80c32 romless, I use a 64k of rom(/cs connect to a specific pin called psen) and 32 k of ram(0000h to 7fffh) , (8000h to ffffh) for other peripheral like 8255 ppi ect.. , it can run 8051 basic... I think a 6502 or z80 can't access more than 32k of rom and ram
@@noureddinebenakrim5458 The 6502 had a unified fully usable 64K address space, but the Z-80 had separately addressable 256 bytes of I/O space though with an undocumented hack a full 64K could be addressed.
@@IMSAIGuy yes yes I know, I wanna just say that the 8051 can access a 64k of rom using (Psen) and a 64k ram using (/read and /write) anyway thank you for replying, so happy with that
I never would have imagined that those capacitors were just Smd ceramics with legs and epoxy.
Also bought on an auction 4 boxes of zener diodes. 40k zener diodes, half 12V and the other half 24V 400 mW type. So I have been using them as regular diodes where the voltage is low enough, and I only need 50mA of current rating. They are great on relay coils, use 2 in series, back to back, 12V on a 5V relay, and 24V on a 12V relay coil. Faster release time, just have to make sure the transistor driving the relay is rated over 60V Vceo, or take a gamble that a 30V rated transistor actually will only break down at over 40V in most cases, which is generally true with modern devices.
Forward bias them at 2A and they turn into light emitting diodes, after a half second or so, at least till the glass case melts. Got a whole string of them, forward biased, as the voltage regulator on some 2F supercapacitors, 4 in series across each 2F capacitor, to replace an old NiCd battery backup pack, so that you get a good enough emulation of the cells, as they are trickle charged. Self discharge of the capacitors is not a worry, as the battery is there for backing up a clock memory, and thus it will work for at least a day of no power. I got tired of replacing the NiCd cells every few years.
😎😎Thank you for sharing! Great one!
Omg the zoom out killed me😂😂
I've got a lot of AVX capacitors too. You hang around eBay long enough you stumble across killer deals. I have more HP SMD LED's than I'll ever be able to use in my lifetime, but for 20 bucks for partial reels it was impossible to pass up.
Very interesting as always ! Thanks ! :)
I had no idea that the SMT diode tabs were flattened copper wire soldered to the die. I envisioned wire bonds in there as dinner other silicon devices packages use.
At 1.50, it's 1A diodes....
Thanks for the presentation
De VU2RZA
I wonder how much IR does it emit when it conducts🤔
3:17 Is that why Diodes show a resistance value when you measure them ? LOL. (sorry)
A great look into how components are made. Thank you.
I want to know how SC devices work and look, so I really liked this one. Good job :)
So many capacitor. I wonder what u will do with them?
Interesting ! Could that white goo be glass ? I mean, it's holding together even after the epoxy separation & still pretty shiny O.o
Is the white goop soft ? Beryllium Oxide paste was used in transistor packages BITD… deadly stuff 😳
seems glassy
@@IMSAIGuy The white goop is a low melting point glass, used to seal in the silicon junction and fuse it to the leads. During manufacture they assemble the diode and place it between the ends of the lead frame, with a thin coat of solder paste on the formed ends. Then the glass is applied as a drop of slurry that covers the silicon and the ends, and dried. Then the whole lot is heated up in a inert atmosphere oven to both melt the solder paste to make the connection to the die, and melt the glass to seal the junction in and hold the die under compression as the glass cools. Then the epoxy overmould is applied.
You get larger diodes where the glass is applied more thickly, and creates a bead around the diode, so after firing the glass holds it together, and there is no need for a epoxy case.
Other manufacturers use instead of glass a white thermoset epoxy, which is heat cured during the soldering time, to do the same protection, as the black epoxy is not a totally hermetic seal, and it does allow water to diffuse through it. That is why your IC packages have the drying sachet in the original packaging, and also why you have to have a specific heating cycle in an oven to bake them if they have been left open, as otherwise the moisture in the package will turn into steam, blowing the epoxy apart. Called popcorning, as it is the exact same process, which destroys the IC.
I thought there was smoke inside of them.
that is what the white stuff is, frozen smoke so obvious 😀
Hello, I don't know why the 8051 cpu are not so popular, and no one makes videos about it
the 8051 is not microprocessor but is a microcontroller (the first one). So access to the (very limited) rom and ram is difficult. The internal ROM is not programmable and the part had to be ordered. the 8031 had external rom if i remember right. The PIC and ATMEL parts took over microcontrollers having programmable parts
@@IMSAIGuy I'm working on 80c32 romless, I use a 64k of rom(/cs connect to a specific pin called psen) and 32 k of ram(0000h to 7fffh) , (8000h to ffffh) for other peripheral like 8255 ppi ect.. , it can run 8051 basic... I think a 6502 or z80 can't access more than 32k of rom and ram
@@noureddinebenakrim5458 The 6502 had a unified fully usable 64K address space, but the Z-80 had separately addressable 256 bytes of I/O space though with an undocumented hack a full 64K could be addressed.
@@noureddinebenakrim5458 the 8080 8085 z80 6502 all have 16 bit address space (64K)
@@IMSAIGuy yes yes I know, I wanna just say that the 8051 can access a 64k of rom using (Psen) and a 64k ram using (/read and /write) anyway thank you for replying, so happy with that