HC2023-T2.2: Chiplets/UCI

Tutorial 2, part 2, Hot Chips 2023, Sunday, August 27, 2023.
Organizers: Debendra Das Sharma, Intel, and Nathan Kalyansundharam, AMD
This tutorial describes the UCIe standards for creating and interconnecting chiplets in multi-chiplet packages. The last two sections of the tutorial, in this video, cover electrical, software, and security factors of the standard.
Electrical, Form Factor, and Compliance
Anwar Kashem, AMD, and Gerald Pasdast, Intel
Software, Manageability, & Security
Jérôme Glisse, Google, and Sridhar Muthrasanallur, Intel