Thermal Electronics Tutorial (1/2) - Methods for improving PCB heat dissipation
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- Опубліковано 7 сер 2024
- #73 In this video I look at some methods of improving the heat dissipation of components placed on a PCB, using some boards from this videos sponsor:
PCBWay Supports High Precision Advanced PCBs: www.pcbway.com/
I try out multiple ideas involving the layout but also PCB parameters and materials. And to check the results I resort to a bit of thermal imaging.
Circuit schematic: drive.google.com/open?id=13rw...
Datasheet used: www.ti.com/lit/ds/symlink/tlv4...
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Thanks for this great video. I usually use the vias method over two layers
I think that's the most common method. I works even better on multi layer boards (4+ layers). You just need to watch out what the "hot" layer is - for example if its the switching node of an SMPS or something noisy or sensitive making its area to large might cause problems.
Im dealing with some overheating on a design so I came straight to your channel and voila! You never fail to deliver. Great work
I am trying to reduce the heat of a LED PCB and this was exactly what I was looking for. Thank you for the great work here!
I like that you took care of the emissivity. good job.
Thanks you so much. Just now I have prepared a foot print using the via heat transfer method, which is more than enough for my application. Here after I'll consider all those method which you mentioned in the video.
Awesome explanation!
Awesome explanation. Many thanks
Very nice tutorial, thanks!
Glad you enjoyed it!
great video easy to watch thanks a lot
Bro... You are the best. Congratulations!! And thanks...!!
I'm happy you enjoyed it! Thank you too!
Thanks, it helped a lot my project
Thanks to share thoses informations !
Nice information
thank you very good video
Great sir, tq.
Hi. Thank you for all your job ! If you have some time one day and if it interests you, I would be interested in how to select an heatsink. They are many parameters to take into account for doing a good design. Base surface, fins, kind of fins, space between fins without talking about materials, etc. There is a good article on wikipedia about heatsink but I did not get the time to do the experiments.
For method with vias hole. How to avoid protrusion during soldering process? PCBway mention cannot do the vias underneath component due to protrusion during soldering process. I also try the vias fill in with resin. But not really prefer that way due the price is very expensive.
Can you do a video on how to design a SMD led board for lightning? Maybe a Quantum Board with an aluminum layer for better dissipation.
how can we calculate copper area on pcb for heat transfer.. or this video shows heat sink for heat transfer if we can use copper pad (open masking) then how to calculate PAD size ..
Hi man, greats videos!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!!
Glad you like them! Thank you!
thank sir
Hai pls make a video on diffusion angle (heat spreading angle) and it's impact on thermal resistance of PCB / Gap filler.
Grate comparison, sadly metal cores are available with only 2 layers, from most manufacturers. What did you use to cote the bods with ? did it made a big difference on the images ?
Hello @Max B ! I just took some random white paint I had around; its not the right time to go out shopping... To be honest it did make a bit of a difference, and I will cover this in the next video (next week)
As I know the solder mask has a bad influence on the thermal performance as well. Is it worth to cut out that layer around the component in question?
Well, if you end up leaving the copper without any solder mask - the reason why you have the solder-mask in the first place re-appears; its there to protect the copper from corrosion and to insulate it electrically. I think that not putting any solder mask will have a minimal thermal influence - its not that good as a thermal insulator because its so thin, but it will cause major reliability issues, so having it is the lesser evil.
This is what UA-cam made for
In my design, can I use a thermal polygon for ac main 230V? I mean, Should I?
Should the trace width/polygon be as long as possible or as minimum as possible? I was thinking the longer and wider the trace, will help in heat sinking. Thanks in Advance. Really liked the video
And forgive me if I'm wrong, but connecting the pad to the copper directly all over the board like board #3 means the 2A is flowing all across the board, Right? Is that fine?
Well, as long as all necessary precautions are taken (for example sufficient distance to other traces) it should not matter if you have a polygon for mains. In the end, the board in a device should not be accessible. Anyway, having polygons or not will not influence the basic circuit - there will still be protection elements like fuses.
Regrading your second point, why would that be a problem? The more and thicker the copper, the lower its resistance is and less self heating occurs. Its quite common in designs to have a "ground plane" that goes all over the board and which has every return current, so you can get quite large peaks.
@@FesZElectronics Oh. Yeah I get what you're saying. And yes the circuit won't be directly accesible to human touch. It will be encased. And because of that and also trying to shrink the size, I was worrying about improving the thermal design. I'm planning on keep a mains polygon on both sides and then using thermal vias like you showed. I was also worried that larger the trace/polygon would increase unwanted capacitance and since voltage is 220vac I was wondering what to do.
Great experiment! But temp with thermal relief: 76,4 C and without: 78,2 C... hmm
Well one of the big issues with this experiment was that the copper thickness was not exactly the same on all boards. I mean they where all 35um on paper, but in practice the thickness was variable. That had quite a big impact on measurement reliability...
Boop