Die attach film adhesives for all die attach applications with 10 micron BLT and stress absorption.

AI Technology, Inc. pioneered the use of flexible die-attach film and paste adhesives for larger chip and die bonding in the early 1980s. The company has since found success in extending its adhesive line to offer the widest selection in the industry. AIT adhesives have been designed for a combination of performance and manufacturing efficiency.

[@sophiaamoguis9253]

good film

[@jwuethrich8385]

have a few too many the night b4 you recorded this or just not into prereading? lol

[@redamethy]

hello, any solution in dice off and adhesive remains on the film during die attach? 😄😄

[@AitechnologyInc]

+redamethy
Hi redamethy, thanks so much for viewing our video and writing. Great question...we'll post an answer shortly... best
AIT

[@AitechnologyInc]

+redamethy Hi Redamethy, After consulting with our resident PhD experts, we have the following answer.
· For a die-attach film application, the adhesive is a film that melt-flows to bond to a wafer at temperatures of 70-80C with a pressure of 10-14 psi. o Afterwards, the wafer is diced and the die with the adhesive stays on the dicing tape until die pickup.o The die with pre-applied die-attach film is again melt-bonded to a substrate for curing at temperatures in the range of above 100C.
· We would like to provide you with the most useful and informative answer possible - so we can truly do so, could you possibly elaborate on and /or provide additional application information and requirements?
Again, thank you for the question.
AIT

[@andymackie2896]

Reading words off the screen is one of the big "no-nos" of presentions.